SCHEMBL20814166

SCHEMBL20814166

C=Cc1ccc(C(=O)O)c(C(=O)NC)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MCL1 Q07820 2/20 0.47
NEU3 Q9UQ49 1/20 0.40
PTPN1 P18031 4/20 0.39
PTPN2 P17706 2/20 0.39
PTPN6 P29350 2/20 0.39
F2 P00734 1/20 0.37
F10 P00742 1/20 0.37
GAA P10253 1/20 0.36
HNF4A P41235 1/20 0.36
TBK1 Q9UHD2 1/20 0.35
HSD17B10 Q99714 2/20 0.35
CDC25A P30304 1/20 0.35
CDC25B P30305 1/20 0.35
PTGS2 P35354 1/20 0.35
ALDH1A1 P00352 2/20 0.35
HPGD P15428 1/20 0.35
MAPK1 P28482 1/20 0.35
TAS1R3 Q7RTX0 1/20 0.35
TAS1R1 Q7RTX1 1/20 0.35
PLK1 P53350 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL220169 0.84 MCL1 (0.51) MCL1PTPN1PTPN2PTPN6HNF4A
SCHEMBL13926965 0.82 ALDH1A1 (0.50) MCL1F2F10ALDH1A1HPGD
SCHEMBL17201241 0.80 GAA (0.51) MCL1GAAALDH1A1MAPK1TAS1R3
SCHEMBL28023538 0.80 MCL1 (0.47) MCL1PTPN1PTPN2PTPN6GAA
SCHEMBL13927042 0.80 ALDH1A1 (0.47) MCL1F2F10GAAALDH1A1
SCHEMBL13926964 0.80 ALDH1A1 (0.51) MCL1F2F10GAAALDH1A1
SCHEMBL940632 0.79 MCL1 (0.48) MCL1PTPN1PTPN2PTPN6TBK1
SCHEMBL13926996 0.78 HPGD (0.44) MCL1GAAALDH1A1HPGDTAS1R3
SCHEMBL13926966 0.78 KMT2A (0.51) MCL1ALDH1A1
SCHEMBL29201441 0.78 KCNA3 (0.49) MCL1GAAPLK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10941320-B2 Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion TORAY INDUSTRIES, INC. (JP) 2021-03-09 US disclosed
US-20190080952-A1 ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION TORAY INDUSTRIES, INC. (JP) 2019-03-14 US disclosed