Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 3/20 | 0.67 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.67 |
| ▸ | RECQL | P46063 | 1/20 | 0.63 |
| ▸ | MEN1 | O00255 | 3/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.61 |
| ▸ | TSHR | P16473 | 1/20 | 0.56 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.55 |
| ▸ | GAA | P10253 | 1/20 | 0.55 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.54 |
| ▸ | RAB9A | P51151 | 1/20 | 0.51 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14821834 | 0.85 | ALDH1A1 (0.61) | POLBALDH1A1MEN1KMT2AGAA | |
| SCHEMBL15448808 | 0.83 | ALDH1A1 (0.78) | POLBALDH1A1RECQLMEN1KMT2A | |
| SCHEMBL16681934 | 0.79 | ALDH1A1 (0.47) | POLBALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL18466208 | 0.79 | ALDH1A1 (0.50) | POLBALDH1A1MEN1KMT2ATSHR | |
| SCHEMBL16566170 | 0.79 | ALDH1A1 (0.50) | POLBALDH1A1GAAL3MBTL1 | |
| SCHEMBL10572512 | 0.78 | ALDH1A1 (0.62) | POLBALDH1A1RECQLMEN1KMT2A | |
| SCHEMBL10569728 | 0.78 | ALDH1A1 (0.62) | POLBALDH1A1RECQLMEN1KMT2A | |
| SCHEMBL14821637 | 0.78 | MGLL (0.51) | POLBALDH1A1SMN1; SMN2GAAL3MBTL1 | |
| SCHEMBL10573727 | 0.78 | ALDH1A1 (0.62) | POLBALDH1A1RECQLMEN1KMT2A | |
| SCHEMBL10568192 | 0.77 | ALDH1A1 (0.60) | POLBALDH1A1RECQLMEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11186757-B2 | Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2021-11-30 | — | — | US | disclosed |
| US-20210139700-A1 | RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAMINATED FILM, PROCESSED WAFER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-10941320-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion | TORAY INDUSTRIES, INC. (JP) | 2021-03-09 | — | — | US | disclosed |
| US-20190080952-A1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION | TORAY INDUSTRIES, INC. (JP) | 2019-03-14 | — | — | US | disclosed |