Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15911094 | 0.89 | — | — | |
| SCHEMBL15911065 | 0.81 | — | — | |
| SCHEMBL4657040 | 0.73 | CES2 (0.30) | — | |
| SCHEMBL3813341 | 0.73 | EPHX1 (0.31) | — | |
| SCHEMBL350254 | 0.73 | EPHX1 (0.31) | — | |
| SCHEMBL17313664 | 0.73 | KEAP1 (0.31) | — | |
| SCHEMBL5118 | 0.73 | EPHX1 (0.31) | — | |
| SCHEMBL16963904 | 0.73 | — | — | |
| SCHEMBL4262674 | 0.73 | — | — | |
| SCHEMBL5709 | 0.73 | EPHX1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117659991-A | Multilayer-coated perovskite quantum dot material, and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-03-08 | — | — | CN | claimed |
| CN-118263381-A | Full-color Micro LED Micro-lens array display device and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-06-28 | — | — | CN | disclosed |
| CN-118159605-A | Resin composition, prepreg, laminated board, metal-clad laminated board, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2024-06-07 | — | — | CN | disclosed |
| CN-117659991-A | Multilayer-coated perovskite quantum dot material, and preparation method and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-03-08 | — | — | CN | disclosed |
| US-11691389-B2 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | RESONAC CORPORATION (JP) | 2023-07-04 | — | — | US | disclosed |
| WO-2023074886-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| CN-115835956-A | Laminate board, printed circuit board, semiconductor package, and method for manufacturing laminate board | 昭和电工材料株式会社 | 2023-03-21 | — | — | CN | disclosed |
| EP-3456779-B1 | PREPREG, METAL FOIL WITH RESIN, LAMINATE AND PRINTED WIRING BOARD | SHOWA DENKO MATERIALS CO LTD (JP) | 2023-03-01 | — | — | EP | disclosed |
| CN-115703932-A | Preparation method and application of double-layer coated perovskite quantum dot/polymer | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2023-02-17 | — | — | CN | disclosed |
| CN-109153837-B | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | 昭和电工材料株式会社 | 2022-08-05 | — | — | CN | disclosed |
| WO-2021256516-A1 | LAMINATED BOARD, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING LAMINATED BOARD | 昭和電工マテリアルズ株式会社 | 2021-12-23 | — | — | WO | disclosed |
| US-20210079172-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | SHOWA DENKO MATERIALS CO., LTD. | 2021-03-18 | — | — | US | disclosed |
| US-20190161586-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| EP-3456779-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-03-20 | — | — | EP | disclosed |