SCHEMBL208342

SCHEMBL208342

C=C(C)C(=O)OCCN1C(=O)C2CCCCC2C1=O

nearest known ligand 0.50

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.43
TP53 P04637 1/20 0.39
THRB P10828 1/20 0.39
RAB9A P51151 3/20 0.39
TSHR P16473 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
KDM4E B2RXH2 1/20 0.38
LMNA P02545 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
ALDH1A1 P00352 5/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7758884 0.85 LMNA (0.37) HTTTHRBRAB9ATSHRSMN1; SMN2
SCHEMBL17532509 0.80 HTT (0.47) HTTTP53RAB9ASMN1; SMN2KDM4E
SCHEMBL22035557 0.79 HTT (0.49) HTTTP53RAB9ASMN1; SMN2KDM4E
SCHEMBL206200 0.78 HTT (0.44) HTTTP53THRBRAB9ATSHR
SCHEMBL4820861 0.78 THRB (0.40) HTTTHRBTSHRSMN1; SMN2KDM4E
SCHEMBL15871833 0.78 THRB (0.44) HTTTHRBTSHRSMN1; SMN2TDP1
SCHEMBL1077589 0.76 ALDH1A1 (0.46) HTTTHRBTSHRSMN1; SMN2TDP1
SCHEMBL2036447 0.76 THRB (0.44) HTTTHRBTSHRSMN1; SMN2TDP1
SCHEMBL22263203 0.76 MAPK1 (0.54) HTTTP53RAB9ATSHRSMN1; SMN2
SCHEMBL17532499 0.76 HTT (0.49) HTTTP53RAB9ASMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6716946-B2 Coating SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-04-06 US claimed
EP-4634157-A1 CYCLIC IMIDES AND ADHESIVE COMPOSITIONS INCLUDING THEM 3M Innovative Properties Company (US) 2025-10-22 EP disclosed
EP-4347673-B1 COMPOSITION INCLUDING CYCLIC IMIDE-CONTAINING MONOMER AND ORGANOBORANE COMPLEX AND RELATED ARTICLES AND METHODS 3M INNOVATIVE PROPERTIES COMPANY (US) 2024-10-09 EP disclosed
US-20240271021-A1 COMPOSITION INCLUDING CYCLIC IMIDE-CONTAINING MONOMER AND ORGANOBORANE COMPLEX AND RELATED ARTICLES AND METHODS 3M INNOVATIVE PROPERTIES COMPANY 2024-08-15 US disclosed
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
WO-2024122417-A1 METHOD FOR PRODUCING LAMINATE WITH HARD COAT LAYER, AND LAMINATE WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
WO-2024117229-A1 PHOTOCURABLE ADHESIVE COMPOSITION FOR PRINTING, CURED PRODUCT, AND LAMINATE 積水化学工業株式会社 2024-06-06 WO disclosed
WO-2024117230-A1 PHOTOCURABLE RESIN COMPOSITION, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING LAMINATE 積水化学工業株式会社 2024-06-06 WO disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
WO-2024101411-A1 CURABLE COMPOSITION FOR ORGANIC EL ELEMENTS, CURED PRODUCT FOR ORGANIC EL ELEMENTS AND METHOD FOR PRODUCING SAME, ORGANIC EL ELEMENT, AND POLYMER JSR株式会社 2024-05-16 WO disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed
US-20100027950-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN CURED MATTER, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE RESIN FILM CURED MATTER AND OPTICAL WAVEGUIDE OBTAINED BY USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-04 US disclosed
US-20090196559-A1 Resin Composition for Optical Materials, Resin Film for Optical Material, and Optical Waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-08-06 US disclosed
EP-2045629-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE Hitachi Chemical Company, Ltd. (JP) 2009-04-08 EP disclosed
US-20070213467-A1 Resin Composition and Semiconductor Device Produced By Using the Same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-09-13 US disclosed
EP-1736520-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Ltd. (JP) 2006-12-27 EP disclosed
EP-1264870-B1 Coating SHINETSU CHEMICAL CO (JP) 2005-10-12 EP disclosed
US-6716946-B2 Coating SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-04-06 US disclosed
US-20030004269-A1 Acrylated resins; high strength, heat resistance SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-01-02 US disclosed
EP-1264870-A1 Coating Shin-Etsu Chemical Co., Ltd. (JP) 2002-12-11 EP disclosed