SCHEMBL20969285

SCHEMBL20969285

Cc1cc2nc3ccc(N)cc3[n+](-c3ccccc3)c2cc1N

nearest known ligand 0.83

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.60
RAB9A P51151 3/20 0.60
NLRP3 Q96P20 1/20 0.60
L3MBTL1 Q9Y468 1/20 0.60
APAF1 O14727 1/20 0.38
KDM4E B2RXH2 6/20 0.37
MAPT P10636 5/20 0.37
ALDH1A1 P00352 5/20 0.37
CASP1 P29466 4/20 0.37
SMN1; SMN2 Q16637 4/20 0.37
HTT P42858 3/20 0.37
ATM Q13315 2/20 0.37
HSD17B10 Q99714 2/20 0.37
TP53 P04637 1/20 0.37
HSP90AA1 P07900 1/20 0.37
HSP90AB1 P08238 1/20 0.37
TSHR P16473 1/20 0.37
TERT O14746 1/20 0.37
BRD4 O60885 1/20 0.36
KMT2A Q03164 3/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL20969348 1.00 NPC1 (0.60) NPC1RAB9ANLRP3L3MBTL1APAF1
Hydrochloric Acid SCHEMBL29353138 0.91 NPC1 (0.47) NPC1RAB9ANLRP3L3MBTL1APAF1
Hydrochloric Acid SCHEMBL15265 0.91 NPC1 (0.47) NPC1RAB9ANLRP3L3MBTL1APAF1
SCHEMBL31680480 0.91 NPC1 (0.47) NPC1RAB9ANLRP3L3MBTL1APAF1
SCHEMBL114128 0.91 NPC1 (0.47) NPC1RAB9ANLRP3L3MBTL1APAF1
SCHEMBL12336666 0.88 NPC1 (0.45) NPC1RAB9ANLRP3L3MBTL1APAF1
Phenosafranine SCHEMBL41415 0.87 RAB9A (0.69) NPC1RAB9ANLRP3L3MBTL1KDM4E
Phenosafranine SCHEMBL29588207 0.87 RAB9A (0.69) NPC1RAB9ANLRP3L3MBTL1KDM4E
Phenosafranine SCHEMBL29424348 0.87 RAB9A (0.69) NPC1RAB9ANLRP3L3MBTL1KDM4E
Phenosafranine SCHEMBL3139756 0.87 RAB9A (0.69) NPC1RAB9ANLRP3L3MBTL1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10982343-B2 Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate ATOTECH DEUTSCHLAND GMBH (DE) 2021-04-20 US disclosed
US-20200347504-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-11-05 US disclosed
EP-3483307-B1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-01 EP disclosed
EP-3483307-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH Deutschland GmbH (DE) 2019-05-15 EP disclosed