Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 3/20 | 0.60 |
| ▸ | RAB9A | P51151 | 3/20 | 0.60 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.60 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.60 |
| ▸ | APAF1 | O14727 | 1/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 6/20 | 0.37 |
| ▸ | MAPT | P10636 | 5/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.37 |
| ▸ | CASP1 | P29466 | 4/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.37 |
| ▸ | HTT | P42858 | 3/20 | 0.37 |
| ▸ | ATM | Q13315 | 2/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.37 |
| ▸ | HSP90AB1 | P08238 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | TERT | O14746 | 1/20 | 0.37 |
| ▸ | BRD4 | O60885 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20969285 | 1.00 | NPC1 (0.60) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| Hydrochloric Acid SCHEMBL29353138 | 0.91 | NPC1 (0.47) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| Hydrochloric Acid SCHEMBL15265 | 0.91 | NPC1 (0.47) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| SCHEMBL31680480 | 0.91 | NPC1 (0.47) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| SCHEMBL114128 | 0.91 | NPC1 (0.47) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| SCHEMBL12336666 | 0.88 | NPC1 (0.45) | NPC1RAB9ANLRP3L3MBTL1APAF1 | |
| Phenosafranine SCHEMBL41415 | 0.87 | RAB9A (0.69) | NPC1RAB9ANLRP3L3MBTL1KDM4E | |
| Phenosafranine SCHEMBL29588207 | 0.87 | RAB9A (0.69) | NPC1RAB9ANLRP3L3MBTL1KDM4E | |
| Phenosafranine SCHEMBL29424348 | 0.87 | RAB9A (0.69) | NPC1RAB9ANLRP3L3MBTL1KDM4E | |
| Phenosafranine SCHEMBL3139756 | 0.87 | RAB9A (0.69) | NPC1RAB9ANLRP3L3MBTL1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | disclosed |
| CN-111295468-B | Electroplating composition for electrolytic copper deposition, use thereof and method for electrolytic deposition of a copper or copper alloy layer on at least one surface of a substrate | 安美特德国有限公司 | 2021-03-30 | — | — | CN | disclosed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | disclosed |
| CN-111295468-A | Electroplating composition for electrolytic copper deposition, use thereof and method for electrolytic deposition of a copper or copper alloy layer on at least one surface of a substrate | 安美特德国有限公司 | 2020-06-16 | — | — | CN | disclosed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | disclosed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | disclosed |