SCHEMBL20969331

SCHEMBL20969331

CCc1cc2nc3cc(CC)c(N)cc3[n+](-c3ccccc3)c2cc1N

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 4/20 0.50
RAB9A P51151 4/20 0.50
L3MBTL1 Q9Y468 2/20 0.50
NLRP3 Q96P20 1/20 0.50
POLB P06746 2/20 0.34
KMT2A Q03164 2/20 0.34
MAPT P10636 2/20 0.34
MEN1 O00255 1/20 0.34
USP2 O75604 1/20 0.34
CACNA1B Q00975 1/20 0.34
APBA1 Q02410 1/20 0.34
ATP4A P20648 2/20 0.33
ATP4B P51164 2/20 0.33
ALDH1A1 P00352 5/20 0.33
KDM4E B2RXH2 3/20 0.33
NCF1 P14598 2/20 0.33
GLA P06280 2/20 0.33
GAA P10253 2/20 0.33
HPGD P15428 2/20 0.33
LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14065809 0.93 NPC1 (0.45) NPC1RAB9AL3MBTL1NLRP3POLB
Butane SCHEMBL931598 0.81 NPC1 (0.49) NPC1RAB9AL3MBTL1NLRP3POLB
SCHEMBL114128 0.80 NPC1 (0.47) NPC1RAB9AL3MBTL1NLRP3POLB
SCHEMBL31680480 0.80 NPC1 (0.47) NPC1RAB9AL3MBTL1NLRP3POLB
Hydrochloric Acid SCHEMBL29353138 0.80 NPC1 (0.47) NPC1RAB9AL3MBTL1NLRP3POLB
Hydrochloric Acid SCHEMBL15265 0.80 NPC1 (0.47) NPC1RAB9AL3MBTL1NLRP3POLB
SCHEMBL12336666 0.77 NPC1 (0.45) NPC1RAB9AL3MBTL1NLRP3POLB
SCHEMBL18806473 0.73 NPSR1 (0.44) NPC1RAB9AL3MBTL1NLRP3CHRM1
Hydrochloric Acid SCHEMBL20969348 0.72 NPC1 (0.60) NPC1RAB9AL3MBTL1NLRP3POLB
SCHEMBL20969285 0.72 NPC1 (0.60) NPC1RAB9AL3MBTL1NLRP3POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10982343-B2 Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate ATOTECH DEUTSCHLAND GMBH (DE) 2021-04-20 US disclosed
US-20200347504-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-11-05 US disclosed
EP-3483307-B1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-01 EP disclosed
EP-3483307-B1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-01 EP disclosed
EP-3483307-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH Deutschland GmbH (DE) 2019-05-15 EP disclosed
EP-3483307-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH Deutschland GmbH (DE) 2019-05-15 EP disclosed