⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2104222 | 0.82 | — | — | |
| SCHEMBL2102430 | 0.73 | — | — | |
| SCHEMBL2099705 | 0.71 | — | — | |
| SCHEMBL2102553 | 0.71 | — | — | |
| SCHEMBL2100689 | 0.69 | DNM1 (0.32) | — | |
| SCHEMBL2100352 | 0.69 | — | — | |
| SCHEMBL2103140 | 0.69 | — | — | |
| SCHEMBL2099803 | 0.68 | — | — | |
| SCHEMBL2103552 | 0.66 | — | — | |
| SCHEMBL9789070 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |
| EP-1142894-B1 | Volatile precursors for deposition of metals and metal-containing films | AIR PROD & CHEM (US) | 2005-01-12 | — | — | EP | disclosed |
| US-6818783-B2 | HOMOLOGOUS EIGHT MEMBERED RING COMPOUNDS HAVING A METAL, SUCH AS COPPER, REVERSIBLY BOUND IN THE RING AND CONTAINING CARBON, NITROGEN, SILICON AND/OR OTHER METALS. | AIR PRODUCTS AND CHEMICALS, INC. | 2004-11-16 | — | — | US | disclosed |
| US-20030135061-A1 | Volatile precursors for deposition of metals and metal-containing films | VERSUM MATERIALS US, LLC | 2003-07-17 | — | — | US | disclosed |
| US-20020013487-A1 | Volatile precursors for deposition of metals and metal-containing films | VERSUM MATERIALS US, LLC | 2002-01-31 | — | — | US | disclosed |
| EP-1142894-A2 | Volatile precursors for deposition of metals and metal-containing films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2001-10-10 | — | — | EP | disclosed |