SCHEMBL2104387

SCHEMBL2104387

CCC([SiH3])c1cccc(N(CC)CC)c1N(CC)CC

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30
CYP3A4 P08684 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2271013 0.84 TSHR (0.34)
SCHEMBL2102669 0.81 CYP1A2 (0.33) ALDH1A1CYP3A4
SCHEMBL2102728 0.77 MAPT (0.35) ALDH1A1
SCHEMBL2100543 0.72 ALDH1A1 (0.34) ALDH1A1CYP3A4
SCHEMBL2272421 0.71 MAPT (0.35) ALDH1A1
SCHEMBL9233119 0.70 TSHR (0.44)
SCHEMBL2102663 0.69 NISCH (0.38) ALDH1A1CYP3A4
SCHEMBL1953279 0.68 ALDH1A1 (0.42) ALDH1A1CYP3A4
SCHEMBL4892490 0.68 ALDH1A1 (0.34) ALDH1A1CYP3A4
SCHEMBL30125051 0.67 TSHR (0.38) ALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed