⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2099965 | 0.74 | — | — | |
| SCHEMBL2101336 | 0.70 | — | — | |
| Trimethylammonium SCHEMBL10388237 | 0.67 | — | — | |
| Trimethylammonium SCHEMBL27531397 | 0.60 | — | — | |
| SCHEMBL22287335 | 0.60 | — | — | |
| SCHEMBL23300848 | 0.60 | — | — | |
| Trimethylammonium SCHEMBL27311607 | 0.57 | — | — | |
| SCHEMBL234006 | 0.56 | — | — | |
| SCHEMBL258875 | 0.56 | — | — | |
| SCHEMBL35636 | 0.56 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260090293-A1 | SEMICONDUCTOR STACKS AND PROCESSES THEREOF | LAM RES CORP (US) | 2026-03-26 | — | — | US | disclosed |
| EP-4591341-A1 | SEMICONDUCTOR STACKS AND PROCESSES THEREOF | LAM Research Corporation (US) | 2025-07-30 | — | — | EP | disclosed |
| WO-2024064161-A1 | SEMICONDUCTOR STACKS AND PROCESSES THEREOF | LAM RESEARCH CORPORATION (US) | 2024-03-28 | — | — | WO | disclosed |
| US-11118050-B2 | Functionalized polymer, rubber composition and pneumatic tire | THE GOODYEAR TIRE & RUBBER COMPANY (US) | 2021-09-14 | — | — | US | disclosed |
| US-11028108-B2 | Method for producing dialkylaminosilane | JNC CORPORATION (JP) | 2021-06-08 | — | — | US | disclosed |
| CN-107406466-B | Process for producing dialkylaminosilane | 捷恩智株式会社 | 2021-05-11 | — | — | CN | disclosed |
| US-20200123180-A1 | METHOD FOR PRODUCING DIALKYLAMINOSILANE | JNC CORPORATION (JP) | 2020-04-23 | — | — | US | disclosed |
| EP-3275886-B1 | METHOD FOR PRODUCING DIALKYLAMINOSILANE | JNC CORP (JP) | 2020-03-11 | — | — | EP | disclosed |
| CN-110325539-A | The manufacturing method of dialkyl amino base silane | 捷恩智株式会社 | 2019-10-11 | — | — | CN | disclosed |
| US-20170298187-A1 | SILICONE RESIN, ENCAPSULATING MATERIAL COMPOSITION FOR UV-LED, CURED PRODUCT AND ENCAPSULATING MATERIAL FOR UV-LED | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2017-10-19 | — | — | US | disclosed |
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20120021127-A1 | MATERIAL FOR CHEMICAL VAPOR DEPOSITION AND PROCESS FOR FORMING SILICON-CONTAINING THIN FILM USING SAME | ADEKA CORPORATION (JP) | 2012-01-26 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |