Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 1/20 | 0.33 |
| ▸ | IDO1 | P14902 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2268392 | 0.86 | CYP3A4 (0.32) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2269107 | 0.85 | IDO1 (0.34) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2102372 | 0.81 | MITF (0.30) | — | |
| SCHEMBL233709 | 0.79 | CYP3A4 (0.38) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2268858 | 0.76 | MEN1 (0.36) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2274658 | 0.75 | IDO1 (0.33) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2099502 | 0.74 | CYP3A4 (0.35) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2099891 | 0.73 | — | — | |
| SCHEMBL2269740 | 0.71 | CYP3A4 (0.33) | CYP3A4TSHRRECQLIDO1 | |
| SCHEMBL2102937 | 0.69 | MEN1 (0.39) | CYP3A4TSHRRECQLIDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |