SCHEMBL2114051

SCHEMBL2114051

CCCO[SiH](OC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2115592 0.92
SCHEMBL2114831 0.86
SCHEMBL705612 0.86
SCHEMBL930258 0.86
SCHEMBL127299 0.86
SCHEMBL3293725 0.85 ADRB2 (0.35)
Butane SCHEMBL3380761 0.83
SCHEMBL10887826 0.83
SCHEMBL2494172 0.83
SCHEMBL931813 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3956376-A1 STABLE SILANE MODIFIED POLYMER COMPOSITION AND METHOD Momentive Performance Materials Inc. (US) 2022-02-23 EP claimed
CN-112126066-A Preparation method of polycarbosilane with high silicon-hydrogen content 宁波曙翔新材料股份有限公司 2020-12-25 CN claimed
CN-111925386-B Preparation method of novel silicon carbide ceramic precursor 长沙科航特种织造有限公司 2020-12-22 CN claimed
WO-2020214935-A1 STABILE SILANE MODIFIED POLYMER COMPOSITION AND METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-10-22 WO claimed
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
US-6509279-B2 Methods for processing a coating film and for manufacturing a semiconductor element TOKYO OHKA KOGYO CO., LTD. (JP) 2003-01-21 US disclosed
US-20020192981-A1 Coating liquid for forming a silica group coating film having a small dielectric constant TOKYO OHKA KOGYO CO., LTD. (JP) 2002-12-19 US disclosed
US-20020192977-A1 Mothods for processing a coating film and for manufacturing a semiconductor element TOKYO OHKA KOGYO CO., LTD. (JP) 2002-12-19 US disclosed
US-20020164886-A1 Method for processing coating film and method for manufacturing semiconductor element with use of the same method TOKYO OHKA KOGYO CO., LTD. (JP) 2002-11-07 US disclosed
EP-1255289-A2 Method for processing a coating film and method for manufacturing a semiconductor element with use of the same method TOKYO OHKA KOGYO CO., LTD. (JP) 2002-11-06 EP disclosed
US-20020009791-A1 Methods for processing a coating film and for manufacturing a semiconductor element TOKYO OHKA KOGYO CO., LTD. (JP) 2002-01-24 US disclosed
US-20010038884-A1 Method for forming coating film on a plate-like workpiece TOKYO OHKA KOGYO CO., LTD. (JP) 2001-11-08 US disclosed
US-20010036998-A1 Anti-reflective coating-forming composition TOKYO OHKA KOGYO CO., LTD. (JP) 2001-11-01 US disclosed