⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL705612 | 0.94 | — | — | |
| SCHEMBL2114051 | 0.92 | — | — | |
| SCHEMBL24612859 | 0.84 | — | — | |
| SCHEMBL27814 | 0.83 | CA1 (0.30) | — | |
| SCHEMBL3911130 | 0.82 | ADRB2 (0.39) | — | |
| SCHEMBL3325129 | 0.80 | THRB (0.35) | — | |
| Fluoride SCHEMBL27875582 | 0.80 | — | — | |
| Bromide SCHEMBL9709407 | 0.80 | — | — | |
| SCHEMBL1706451 | 0.80 | — | — | |
| SCHEMBL2805172 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 171 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040092759-A1 | Process for making haloalkylalkoxysilanes | MOMENTIVE PERFORMANCE MATERIALS INC. | 2004-05-13 | — | — | US | claimed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| CN-112724405-B | Curing agent mixture | 赢创运营有限公司 | 2024-01-30 | — | — | CN | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| EP-4212567-A1 | EPOXY RESIN COMPOSITION | ThreeBond Co., Ltd. (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-115678542-A | Quaternary nanostructure based on bright silver | 纳米系统公司 | 2023-02-03 | — | — | CN | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| EP-3816247-B1 | CURING MIXTURE | EVONIK OPERATIONS GMBH (DE) | 2022-12-07 | — | — | EP | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-6767839-B1 | Method for forming multi-layer wiring structure | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-07-27 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-20040092759-A1 | Process for making haloalkylalkoxysilanes | MOMENTIVE PERFORMANCE MATERIALS INC. | 2004-05-13 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |
| US-5614251-A | Method and liquid coating composition for the formation of silica-based coating film on substrate surface | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-03-25 | — | — | US | disclosed |
| US-5496402-A | Method and liquid coating composition for the formation of silica-based coating film on substrate surface | TOKYO OHKA KOGYO CO, LTD. (JP) | 1996-03-05 | — | — | US | disclosed |