SCHEMBL21143009

SCHEMBL21143009

Cc1ccc(Sc2ccc(C)c(-c3ccccc3)c2)cc1-c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 1/20 0.45
CYP2B6 P20813 1/20 0.45
ESR2 Q92731 1/20 0.42
MAOA P21397 2/20 0.42
MAOB P27338 2/20 0.42
BCL2 P10415 2/20 0.40
MCL1 Q07820 2/20 0.40
KDM4E B2RXH2 1/20 0.39
BACE1 P56817 1/20 0.38
ALDH1A1 P00352 4/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2C19 P33261 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
DHFR P00374 1/20 0.37
TP53 P04637 1/20 0.37
MAPT P10636 1/20 0.37
HPGD P15428 2/20 0.35
NPC1 O15118 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6716919 0.87 AR (0.44) CYP2A6CYP2B6ESR2KDM4EALDH1A1
SCHEMBL12256976 0.83 MAOA (0.44) MAOAMAOBBCL2MCL1ALDH1A1
SCHEMBL1844887 0.83 ESR2 (0.57) CYP2A6CYP2B6ESR2MAOAMAOB
SCHEMBL28128180 0.81 ESR2 (0.38) CYP2A6CYP2B6ESR2KDM4EBACE1
SCHEMBL19086319 0.80 ESR2 (0.53) CYP2A6CYP2B6ESR2MAOAMAOB
SCHEMBL27409215 0.79 MAOA (0.35) CYP2A6CYP2B6ESR2MAOAMAOB
SCHEMBL27562020 0.77 MAOA (0.56) ESR2MAOAMAOBBCL2MCL1
SCHEMBL277849 0.76 HDAC7 (0.50) CYP2A6CYP2B6ESR2MAOBKDM4E
SCHEMBL29535942 0.76 HDAC7 (0.50) CYP2A6CYP2B6ESR2MAOBKDM4E
SCHEMBL7930011 0.76 L3MBTL1 (0.47) CYP2A6CYP2B6ESR2MAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113921448-B Fitting body 古河电气工业株式会社 2025-03-25 CN claimed
CN-113921448-B Fitting body 古河电气工业株式会社 2025-03-25 CN disclosed
CN-118632763-A Bonding material composition, method for producing bonding material composition, bonding film, method for producing bonded body, and bonded body 古河电气工业株式会社 2024-09-10 CN disclosed
CN-112533934-B Polyoxometallate compounds exhibiting bright emissions and methods of making same 纳米2D材料有限公司 2024-07-19 CN disclosed
CN-114068067-A Metal-containing particle, connecting material, connecting structure and method for producing same, conduction test member, and conduction test device 积水化学工业株式会社 2022-02-18 CN disclosed
CN-111095441-B Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device 积水化学工业株式会社 2021-11-23 CN disclosed
CN-108140450-B Metal-containing particle, connecting material, connection structure, and method for producing connection structure 积水化学工业株式会社 2021-08-03 CN disclosed
CN-107848077-B Composition containing metal particles 古河电气工业株式会社 2020-12-15 CN disclosed
US-20200269315-A1 METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2020-08-27 US disclosed
EP-3686903-A1 METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE Sekisui Chemical Co., Ltd. (JP) 2020-07-29 EP disclosed
CN-111095441-A Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device 积水化学工业株式会社 2020-05-01 CN disclosed
US-10611869-B2 Curable composition and cured product AGC Inc. (JP) 2020-04-07 US disclosed
US-20190218325-A1 CURABLE COMPOSITION AND CURED PRODUCT AGC Inc. (JP) 2019-07-18 US disclosed