SCHEMBL21176776

SCHEMBL21176776

C=C(Cn1c(=O)[nH]c(=O)[nH]c1=O)C(=O)O

nearest known ligand 0.37

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21176778 0.84 APEX1 (0.50) APEX1
SCHEMBL10969362 0.81 APEX1 (0.36) APEX1
SCHEMBL4184455 0.79 APEX1 (0.47) APEX1
SCHEMBL27493496 0.77 APEX1 (0.32) APEX1
SCHEMBL21176777 0.76 APEX1 (0.39) APEX1
SCHEMBL1247958 0.75 ALDH1A1 (0.37) APEX1
Methacrylic Acid SCHEMBL4249534 0.73 KMT2A (0.36) APEX1
SCHEMBL14123131 0.72 HPGD (0.37) APEX1
SCHEMBL28491993 0.72 APEX1 (0.36) APEX1
Methacrylic Acid SCHEMBL1914676 0.71 APEX1 (0.37) APEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4063061-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2024-04-24 EP claimed
CN-113423850-A Flux and solder paste 千住金属工业株式会社 2021-09-21 CN claimed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US claimed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP claimed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN claimed
EP-4063061-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2024-04-24 EP disclosed
EP-4063060-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2024-04-24 EP disclosed
EP-3741498-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2023-08-02 EP disclosed
EP-4063060-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2022-09-28 EP disclosed
EP-4063060-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2022-09-28 EP disclosed
CN-111655421-B Flux and solder paste 千住金属工业株式会社 2022-07-26 CN disclosed
CN-111655421-B Flux and solder paste 千住金属工业株式会社 2022-07-26 CN disclosed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US disclosed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US disclosed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP disclosed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP disclosed
WO-2020203730-A1 FLUX AND SOLDER PASTE 千住金属工業株式会社 2020-10-08 WO disclosed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN disclosed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN disclosed
WO-2019142826-A1 FLUX AND SOLDER PASTE 千住金属工業株式会社 2019-07-25 WO disclosed