SCHEMBL21176777

SCHEMBL21176777

C=C(Cn1c(=O)n(CC(=C)C(=O)O)c(=O)n(CC(=C)C(=O)O)c1=O)C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 2/20 0.39
TET2 Q6N021 5/20 0.37
TET3 O43151 1/20 0.34
TET1 Q8NFU7 1/20 0.34
GRIK1 P39086 1/20 0.33
GRIK2 Q13002 1/20 0.33
GRM1 Q13255 1/20 0.33
GRM2 Q14416 1/20 0.33
CYP3A4 P08684 1/20 0.33
ALOX15 P16050 1/20 0.33
HSD17B10 Q99714 1/20 0.33
POLB P06746 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21176778 0.85 APEX1 (0.50) APEX1TET2CYP3A4POLBSMN1; SMN2
SCHEMBL21176776 0.76 APEX1 (0.37) APEX1
SCHEMBL536501 0.76 APEX1 (0.38) APEX1CYP3A4
Methacrylic Acid SCHEMBL4942155 0.75 APEX1 (0.35) APEX1CYP3A4MAPT
SCHEMBL677187 0.73 APEX1 (0.62) APEX1
SCHEMBL295471 0.69 HTT (0.46) APEX1CYP3A4HSD17B10
SCHEMBL23768669 0.67 HTT (0.41) APEX1MAPT
Methacrylic Acid SCHEMBL10441412 0.67 APEX1 (0.32) APEX1TET2CYP3A4
SCHEMBL844617 0.67
SCHEMBL12764472 0.67 ALDH1A1 (0.46) TET2TET3TET1GRIK1GRIK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113423850-A Flux and solder paste 千住金属工业株式会社 2021-09-21 CN claimed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US claimed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP claimed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN claimed
EP-4063061-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2024-04-24 EP disclosed
EP-4063060-B1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2024-04-24 EP disclosed
EP-4063060-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2022-09-28 EP disclosed
EP-4063060-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2022-09-28 EP disclosed
CN-111655421-B Flux and solder paste 千住金属工业株式会社 2022-07-26 CN disclosed
CN-111655421-B Flux and solder paste 千住金属工业株式会社 2022-07-26 CN disclosed
CN-113423850-A Flux and solder paste 千住金属工业株式会社 2021-09-21 CN disclosed
CN-113423850-A Flux and solder paste 千住金属工业株式会社 2021-09-21 CN disclosed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US disclosed
US-20210060715-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2021-03-04 US disclosed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP disclosed
EP-3741498-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd (JP) 2020-11-25 EP disclosed
WO-2020203730-A1 FLUX AND SOLDER PASTE 千住金属工業株式会社 2020-10-08 WO disclosed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN disclosed
CN-111655421-A Flux and solder paste 千住金属工业株式会社 2020-09-11 CN disclosed
WO-2019142826-A1 FLUX AND SOLDER PASTE 千住金属工業株式会社 2019-07-25 WO disclosed