SCHEMBL212683

SCHEMBL212683

CCC1(COCCOc2ccc(Br)c(Br)c2Br)COC1

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 4/20 0.33
MAPT P10636 3/20 0.33
TDP1 Q9NUW8 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
TSHR P16473 1/20 0.31
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1044347 0.94 TSHR (0.31) L3MBTL1MAPTTDP1SMN1; SMN2TSHR
SCHEMBL215820 0.88 TSHR (0.34) TSHR
SCHEMBL29366880 0.88 TSHR (0.34) TSHR
SCHEMBL216741 0.87 TDP1 (0.34) L3MBTL1MAPTTDP1SMN1; SMN2TSHR
SCHEMBL213172 0.74 TSHR (0.34) TSHR
SCHEMBL30771659 0.74 SMN1; SMN2 (0.52) MAPTSMN1; SMN2TSHRKDM4E
SCHEMBL466247 0.73 LTA4H (0.40)
SCHEMBL215324 0.73 TDP1 (0.39) MAPTTDP1TSHR
SCHEMBL29366886 0.73 TDP1 (0.39) MAPTTDP1TSHR
SCHEMBL2830458 0.73 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 240 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US claimed
EP-4157905-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY Blue Cube IP LLC (US) 2023-04-05 EP claimed
US-20100119835-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN INTERNATIONAL LLC (US) 2010-05-13 US claimed
EP-2118197-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES Huntsman Advanced Materials (Switzerland) GmbH (CH) 2009-11-18 EP claimed
WO-2008110512-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-09-18 WO claimed
US-20230364928-A1 INKJET INK, METHOD FOR MANUFACTURING PRINTED MATERIAL, AND PRINTED MATERIAL NATOCO CO., LTD. (JP) 2023-11-16 US disclosed
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US disclosed
EP-4157905-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY Blue Cube IP LLC (US) 2023-04-05 EP disclosed
US-20210237484-A1 METHOD FOR PRODUCING INKJET PRINTED MATERIAL AND INKJET PRINTED MATERIAL NATOCO CO., LTD. (JP) 2021-08-05 US disclosed
EP-3199520-B1 SULFONIUM SALT, PHOTOACID GENERATOR, AND PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-25 EP disclosed
US-10386721-B2 Pattern formation method and electronic device manufactured using same ADEKA CORPORATION (JP) 2019-08-20 US disclosed
EP-3272737-B1 SULFONIC ACID DERIVATIVE COMPOUND, PHOTOACID GENERATOR, RESIST COMPOSITION, CATIONIC POLYMERIZATION INITIATOR, AND CATIONICALLY POLYMERIZABLE COMPOSITION ADEKA CORP (JP) 2019-07-24 EP disclosed
EP-1277776-A1 Photocurable resin composition for sealing material and method of sealing Mitsui Chemicals, Inc. (JP) 2003-01-22 EP disclosed
US-6368769-B1 PHOTOPOLYMERIZATION ASAHI DENKI KOGYO KABUSHIKI KAISHA (JP) 2002-04-09 US disclosed
US-6365644-B1 TO PROVIDE CURED PRODUCT HAVING MECHANICAL STRENGTH AND MINIMIZED SHRINKAGE DURING CURING TO ENSURE HIGH DIMENSIONAL ACCURACY DSM N.V. (NL) 2002-04-02 US disclosed
EP-1138739-A1 PHOTOCURABLE RESIN COMPOSITION FOR SEALING MATERIAL AND METHOD OF SEALING Mitsui Chemicals, Inc. (JP) 2001-10-04 EP disclosed
EP-0848294-B1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM NV (NL) 2001-09-19 EP disclosed
EP-1036789-A1 NOVEL AROMATIC SULFONIUM COMPOUNDS, PHOTOACID GENERATORS COMPRISING THE SAME, PHOTOPOLYMERIZABLE COMPOSITIONS CONTAINING THE SAME, STEREOLITHOGRAPHIC RESIN COMPOSITIONS, AND STEREOLITHOGRAPHIC PROCESS ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2000-09-20 EP disclosed
US-5981616-A OXETANE COMPOUND, EPOXY COMPOUND CONSISTING OF EXPOXIDIZED POLYMERS OF CONJUGATED DIENE MONOMERS, EXPOXIDIZED COPOLYMERS OF DIENE MONOMERS AND COMPOUNDS HAVING AN ETHYLENICALLY UNSATURATED BOND, AND EXPOXIDIZED NATURAL RUBBER DSM N.V. (NL) 1999-11-09 US disclosed
EP-0848294-A1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM N.V. (NL) 1998-06-17 EP disclosed