SCHEMBL2128307

SCHEMBL2128307

[O]c1ccccc1N=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30307825 0.81 NPC1 (0.38)
SCHEMBL234460 0.81 NPC1 (0.38)
Charcoal, Activated SCHEMBL8610664 0.78 NPC1 (0.36)
Naphthalene SCHEMBL27361432 0.73 CYP2A6 (0.50)
SCHEMBL28224749 0.73 MEN1 (0.40)
SCHEMBL10522204 0.70 CYP3A4 (0.54)
SCHEMBL446264 0.69
SCHEMBL9778149 0.69 ALDH1A1 (0.57)
SCHEMBL12318653 0.69 GABRA1 (0.44)
SCHEMBL28157183 0.69 ALDH1A1 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023127890-A1 ADHESIVE COMPOSITION AND LAMINATE WITH ADHESIVE LAYER 東亞合成株式会社 2023-07-06 WO disclosed
CN-112867773-B Adhesive composition and hot-melt member using same 东亚合成株式会社 2023-04-11 CN disclosed
CN-112639042-B Adhesive composition and hot-melt member using same 东亚合成株式会社 2022-10-28 CN disclosed
CN-111196066-B Adhesive composition and adhesive layer-equipped laminate using same 东亚合成株式会社 2022-05-10 CN disclosed
CN-114040943-A Resin composition, laminate with resin composition layer, laminate, and electromagnetic wave shielding film 东亚合成株式会社 2022-02-11 CN disclosed
CN-110072961-B Adhesive composition, and cover film, adhesive sheet, copper-clad laminate and electromagnetic wave shielding material using same 东亚合成株式会社 2022-02-08 CN disclosed
CN-110799612-B Adhesive composition and hot-melt adhesive member using same 东亚合成株式会社 2021-07-20 CN disclosed
WO-2021131812-A1 ADHESIVE COMPOSITION, THERMALLY FUSIBLE MEMBER, AND SECONDARY BATTERY PACKAGING MATERIAL 東亞合成株式会社 2021-07-01 WO disclosed
CN-112867773-A Adhesive composition and hot-melt member using same 东亚合成株式会社 2021-05-28 CN disclosed
CN-112639042-A Adhesive composition and hot-melt member using same 东亚合成株式会社 2021-04-09 CN disclosed
US-20040059064-A1 Modified polyolefin resin, modified polyolefin resin composition, and uses thereof NIPPON PAPER INDUSTRIES CO., LTD. (JP) 2004-03-25 US disclosed
US-6643591-B1 Predicting metabolism profiles UNIVERSITY OF PITTSBURGH 2003-11-04 US disclosed
US-20030120470-A1 Use of computational and experimental data to model organic compound reactivity in cytochrome P450 mediated reactions and to optimize the design of pharmaceuticals UNIVERSITY OF PITTSBURGH AND UNIVERSITY OF ROCHESTER 2003-06-26 US disclosed
EP-1321481-A1 MODIFIED POLYOLEFIN RESIN, MODIFIED POLYOLEFIN RESIN COMPOSITION, AND USE THEREOF NIPPON PAPER INDUSTRIES CO., LTD. (JP) 2003-06-25 EP disclosed
US-6495629-B2 CHLORINE-FREE MODIFIED POLYOLEFIN RESIN BLEND WITH EXCELLENT ADHERENCE TO NONPOLAR RESIN MOLDINGS, EXCELLENT SOLVENT SOLUBILITY AND NO TACK AFTER PAINTING AND DRYING; COMPRISES COPOLYMER BLEND GRAFTED WITH UNSATURATED ACID OR ANHYDRIDE NIPPON PAPER INDUSTRIES CO., LTD. (JP) 2002-12-17 US disclosed
US-20010036997-A1 Modified polyolefin resin composition and uses thereof NIPPON PAPER INDUSTRIES CO., LTD (JP) 2001-11-01 US disclosed
EP-1142918-A1 Modified polyolefin resin composition and uses thereof NIPPON PAPER INDUSTRIES CO., LTD. (JP) 2001-10-10 EP disclosed
EP-1102861-A1 MODELLING ORGANIC COMPOUND REACTIVITY IN CYTOCHROME P450 MEDIATED REACTIONS UNIVERSITY OF PITTSBURGH (US) 2001-05-30 EP disclosed
WO-2000008205-A1 MODELLING ORGANIC COMPOUND REACTIVITY IN CYTOCHROME P450 MEDIATED REACTIONS UNIVERSITY OF PITTSBURGH (US) 2000-02-17 WO disclosed
US-5071929-A A malemide, a naphthalene-vinylbenzyl ether, and a benzene vinyl benzyl ether; low temperature curing; heat resistance, mechamical strength; molding materials SHOWA HIGHPOLYMER CO., LTD. (JP) 1991-12-10 US disclosed