SCHEMBL2132181

SCHEMBL2132181

CCCC(NC(C)N)[SiH](OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10893879 1.00
SCHEMBL3151163 0.85
SCHEMBL8621576 0.83
SCHEMBL9323811 0.83
SCHEMBL8011667 0.82 OPRM1 (0.31)
SCHEMBL17650 0.78 ALDH1A1 (0.33)
SCHEMBL1066104 0.76
SCHEMBL302745 0.74
SCHEMBL5678512 0.72
SCHEMBL21409762 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114262600-A Low-water-vapor-permeability silicone sealant 广州市白云化工实业有限公司 2022-04-01 CN claimed
CN-110527293-B Basalt flake fiber modified polyimide film 黑龙江省科学院高技术研究院 2022-03-15 CN claimed
CN-106902396-B Method for preparing antibacterial surface on surface of medical material 华南理工大学 2021-01-19 CN claimed
CN-111944331-A Surface modification treatment method of anti-settling boron carbide powder 上海核工程研究设计院有限公司 2020-11-17 CN claimed
EP-3069778-B1 COMPOSITION FOR REMOVING ALDEHYDE FROM AIR ARMSTRONG WORLD IND INC (US) 2018-03-07 EP claimed
EP-2313178-B1 ALDEHYDE REDUCING COMPOSITIONS AWI LICENSING CO (US) 2016-05-18 EP claimed
US-6737119-B1 DISPERSION OF A VINYL-MODIFIED COLLOIDAL SILICA, PLATINUM CHELATE CATALYST, A POLYSILOXANE WATER-DISPERSIBLE SILICONE EMULSION TORAY SAEHAN INCORPORATION (KR) 2004-05-18 US claimed
EP-0972303-A1 LOW DIELECTRIC CONSTANT MATERIAL WITH IMPROVED DIELECTRIC STRENGTH W.L. GORE & ASSOCIATES, INC. (US) 2000-01-19 EP claimed
WO-1998044544-A1 LOW DIELECTRIC CONSTANT MATERIAL WITH IMPROVED DIELECTRIC STRENGTH W.L. GORE & ASSOCIATES, INC. (US) 1998-10-08 WO claimed
WO-1998044546-A1 METHOD TO IMPROVE ADHESION OF A THIN SUBMICRON FLUOROPOLYMER FILM ON AN ELECTRONIC DEVICE W.L. GORE & ASSOCIATES, INC. (US) 1998-10-08 WO claimed
WO-1998044545-A1 METHOD TO IMPROVE ADHESION OF A THIN SUBMICRON FLUOROPOLYMER FILM ON AN ELECTRONIC DEVICE W.L. GORE & ASSOCIATES, INC. (US) 1998-10-08 WO claimed
US-4427034-A AMINOALKOXYSILANE WITH AN ALKYD, EPOXY, OR ACRYLIC RESIN, OR POLYURETHANE SUMITOMO LIGHT METAL INDUSTRIES, LTD. (JP) 1984-01-24 US claimed
WO-2023233512-A1 COLLOIDAL SILICA AND METHOD FOR PRODUCING SAME 扶桑化学工業株式会社 2023-12-07 WO disclosed
EP-4051737-B1 WOOD POLYMER COMPOSITES AND ADDITIVE SYSTEMS THEREFOR STRUKTOL COMPANY OF AMERICA LLC (US) 2023-08-16 EP disclosed
CN-114262600-A Low-water-vapor-permeability silicone sealant 广州市白云化工实业有限公司 2022-04-01 CN disclosed
CN-110527293-B Basalt flake fiber modified polyimide film 黑龙江省科学院高技术研究院 2022-03-15 CN disclosed
EP-0108946-A2 Curing composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-05-23 EP disclosed
US-4427034-A AMINOALKOXYSILANE WITH AN ALKYD, EPOXY, OR ACRYLIC RESIN, OR POLYURETHANE SUMITOMO LIGHT METAL INDUSTRIES, LTD. (JP) 1984-01-24 US disclosed
US-4332874-A Photosensitive bis-azide composition with acrylic terpolymer and pattern-forming method HITACHI, LTD. (JP) 1982-06-01 US disclosed
EP-0028486-A1 Photosensitive composition and pattern-forming method Hitachi, Ltd. (JP) 1981-05-13 EP disclosed