SCHEMBL2139589

SCHEMBL2139589

C#CC(C)(C)O[SiH](C=CC)OC(C)(C)C#C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4270325 0.72
SCHEMBL3697817 0.69
SCHEMBL23781320 0.67
SCHEMBL8715614 0.67
SCHEMBL1786597 0.62
SCHEMBL6895736 0.61
SCHEMBL179845 0.61
SCHEMBL8698339 0.59 ELANE (0.30)
SCHEMBL6898051 0.59
SCHEMBL725671 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 272 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12338348-B2 Thermal conductive silicone composition DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA (JP) 2025-06-24 US claimed
US-20230104725-A1 THERMAL CONDUCTIVE SILICONE COMPOSITION DUROPTIX MATERIALS KABUSHIKI KAISHA (JP) 2023-04-06 US claimed
CN-115820223-A Thermally conductive silicone composition 杜邦东丽特殊材料株式会社 2023-03-21 CN claimed
EP-3710544-B1 HYDROSILYLATION-CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2021-08-11 EP claimed
US-6586535-B1 Polysiloxanes containing alkenyl groups DOW CORNING CORPORATION 2003-07-01 US claimed
US-6489407-B1 SOLVENT-FREE (CO-)POLYSILOXANES USED AS ANTISTICK AGENTS FOR LAMINATION OF PAPER SUBSTRATES DOW CORNING CORPORATION 2002-12-03 US claimed
US-6124419-A A RELEASE MODIFIER COMPRISING AN ALKENYL FUNCTIONAL POLYORGANOSILOXANE AND A BRANCHED OLEFIN USEFUL IN RELEASE PRESSURE SENSITIVE ADHESIVES FROM A VARIETY OF SUBSTRATES DOW CORNING, LIMITED (GB) 2000-09-26 US claimed
EP-0980903-A2 Release modifier compositions DOW CORNING CORPORATION (US) 2000-02-23 EP claimed
US-5708046-A ALKENYL SILOXANES, ORGANOHYDROGENSILOXANES, POLYMERIZATION INHIBITORS FOR STORAGE STABILITY DOW CORNING CORPORATION (US) 1998-01-13 US claimed
EP-0764703-A2 Silicone release coating compositions Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-26 EP claimed
US-20260132325-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-05-14 US disclosed
CN-122011778-A Gel-type thermal interface material 霍尼韦尔国际公司 2026-05-12 CN disclosed
EP-4370606-B1 THERMAL CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-01-28 EP disclosed
US-20260022209-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2026-01-22 US disclosed
US-12509585-B2 Thermal conductive silicone composition DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA (JP) 2025-12-30 US disclosed
EP-0971367-A1 Electrically conductive silicone compositions DOW CORNING CORPORATION (US) 2000-01-12 EP disclosed
US-5914192-A COMPOSITION COMPRISING POLYSILOXANES HAVING ALKENYL GROUPS AND SILICON-BONDED HYDROGEN ATOMS, ALCOHOL CONTAINING TRIPLE BOND, COMPOUND HAVING TRIPLE BOND-CONTAINING HYDROCARBON GROUPS BONDED TO SILICON THROUGH OXYGEN ATOM, PLATINUM CATALYST DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-06-22 US disclosed
EP-0845510-A2 Silicone release coating compositions Dow Corning Toray Silicone Company, Ltd. (JP) 1998-06-03 EP disclosed
US-5708046-A ALKENYL SILOXANES, ORGANOHYDROGENSILOXANES, POLYMERIZATION INHIBITORS FOR STORAGE STABILITY DOW CORNING CORPORATION (US) 1998-01-13 US disclosed
EP-0764703-A2 Silicone release coating compositions Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-26 EP disclosed