SCHEMBL179845

SCHEMBL179845

C#CC(C)(C)O[SiH](OC(C)(C)C#C)[SiH](C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8715614 0.69
SCHEMBL23781320 0.69
SCHEMBL6895736 0.67
SCHEMBL3697817 0.66
SCHEMBL23293756 0.61
SCHEMBL2139589 0.61
SCHEMBL725671 0.61
SCHEMBL10018801 0.60
SCHEMBL1788916 0.58
SCHEMBL968639 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 236 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12037459-B2 Additive organopolysiloxane composition, curable composition, and film DOW SILICONES CORPORATION 2024-07-16 US disclosed
US-20240228848-A9 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING A FLUOROSILICONE ADDITIVE AND METHODS FOR THE PREPARATION AND USE THEREOF DOW (SHANGHAI) HOLDING CO., LTD. (CN) 2024-07-11 US disclosed
WO-2024138039-A1 THERMALLY-CONDUCTIVE SILICONE COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE DOW SILICONES CORPORATION (US) 2024-06-27 WO disclosed
US-20240182755-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING A CYANATE-FUNCTIONAL SILANE ADDITIVE AND METHODS FOR THE PREPARATION AND USE OF SAID COMPOSITION DOW SILICONES CORPORATION 2024-06-06 US disclosed
US-20240174904-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING A POLYFLUOROPOLYETHER SILANE ADDITIVE AND METHODS FOR THE PREPARATION AND USE OF SAID COMPOSITION DOW (SHANGHAI) HOLDING CO., LTD. (CN) 2024-05-30 US disclosed
EP-4212575-B1 METHODS FOR MAKING POLYFUNCTIONAL ORGANOSILOXANES AND COMPOSITIONS CONTAINING SAME DOW SILICONES CORP (US) 2024-05-29 EP disclosed
US-20240166929-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING A FLUORO-CONTAINING POLYORGANOHYDROGENSILOXANE CROSSLINKER AND METHODS FOR THE PREPARATION AND USE OF SAID COMPOSITION DOW SILICONES CORPORATION 2024-05-23 US disclosed
EP-4146762-B1 SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES DOW SILICONES CORP (US) 2024-05-08 EP disclosed
US-20240141210-A1 SILICONE HYBRID PRESSURE SENSITIVE ADHESIVE AND METHODS FOR ITS PREPARATION AND USE ON UNEVEN SURFACES DOW CHEMICAL SILICONES KOREA, LTD. (KR) 2024-05-02 US disclosed
US-20240132763-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING A FLUOROSILICONE ADDITIVE AND METHODS FOR THE PREPARATION AND USE THEREOF JIANG JINGUI (CN) 2024-04-25 US disclosed
EP-2402795-A2 Optical devices and silicone compositions and processes fabricating the optical devices Dow Corning Corporation (US) 2012-01-04 EP disclosed
EP-2402796-A2 Optical devices and silicone compositions and processes fabricating the optical devices Dow Corning Corporation (US) 2012-01-04 EP disclosed
EP-2069829-B1 OPTICAL DEVICES AND SILICONE COMPOSITIONS AND PROCESSES FABRICATING THE OPTICAL DEVICES DOW CORNING (US) 2011-12-07 EP disclosed
WO-2010138221-A1 SILICONE COMPOSITION FOR PRODUCING TRANSPARENT SILICONE MATERIALS AND OPTICAL DEVICES DOW CORNING CORPORATION (US) 2010-12-02 WO disclosed
US-20100276721-A1 Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones DOW CORNING CORPORATION (US) 2010-11-04 US disclosed
EP-2069829-A2 OPTICAL DEVICES AND SILICONE COMPOSITIONS AND PROCESSES FABRICATING THE OPTICAL DEVICES Dow Corning Corporation (US) 2009-06-17 EP disclosed
US-20090146175-A1 THERMAL STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE DOW CORNING CORPORATION 2009-06-11 US disclosed
EP-1973963-A1 THERMALLY STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE Dow Corning Corporation (US) 2008-10-01 EP disclosed
WO-2008027280-A2 OPTICAL DEVICES AND SILICONE COMPOSITIONS AND PROCESSES FABRICATING THE OPTICAL DEVICES DOW CORNING CORPORATION (US) 2008-03-06 WO disclosed
WO-2007086987-A1 THERMALLY STABLE TRANSPARENT SILICONE RESIN COMPOSITIONS AND METHODS FOR THEIR PREPARATION AND USE DOW CORNING CORPORATION (US) 2007-08-02 WO disclosed