SCHEMBL8715614

SCHEMBL8715614

C#CC(C)(C)O[SiH](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23781320 0.82
SCHEMBL3697817 0.79
SCHEMBL23293756 0.73
SCHEMBL10018801 0.71
SCHEMBL179845 0.69
SCHEMBL8698339 0.67 ELANE (0.30)
SCHEMBL6898051 0.67
SCHEMBL2139589 0.67
SCHEMBL725671 0.67
SCHEMBL134560 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117795009-A Antistatic organosilicon release coating and preparation and use methods thereof 美国陶氏有机硅公司 2024-03-29 CN disclosed
CN-117715986-A Hydrosilylation curable polyorganosiloxane compositions, methods of making the same, and use thereof in encapsulation films 美国陶氏有机硅公司 2024-03-15 CN disclosed
CN-114901764-B Composition for preparing release coating, release coating composition and related methods 美国陶氏有机硅公司 2024-03-08 CN disclosed
CN-117480229-A Silicone pressure sensitive adhesive composition containing cyanate ester functionalized silane additive, method for preparing same and use of said composition 美国陶氏有机硅公司 2024-01-30 CN disclosed
CN-114258423-B Silicone pressure-sensitive adhesive composition, preparation thereof and use thereof in protective film of ultrasonic fingerprint sensor 美国陶氏有机硅公司 2024-01-26 CN disclosed
CN-117412860-A Silicone pressure sensitive adhesive compositions containing polyfluoropolyether silane additives, methods of making and uses of the compositions 美国陶氏有机硅公司 2024-01-16 CN disclosed
CN-117321160-A Silicone pressure sensitive adhesive compositions comprising fluorine-containing polyorganosiloxane crosslinking agent, methods of making and uses of the compositions 美国陶氏有机硅公司 2023-12-29 CN disclosed
CN-117242149-A Silicone pressure sensitive adhesive compositions containing fluorosilicone additives, methods of making and uses thereof 美国陶氏有机硅公司 2023-12-15 CN disclosed
CN-117178005-A Composition for preparing release coating and method for preparing coated substrate 美国陶氏有机硅公司 2023-12-05 CN disclosed
CN-117120572-A Silicone pressure sensitive adhesives cured by hydrosilylation reaction, compositions, methods of making same, and use in flexible display devices 美国陶氏有机硅公司 2023-11-24 CN disclosed
CN-109152978-B Method for reducing volatile components in mixtures using crosslinked elastomer adsorbents and device for carrying out said method 美国陶氏有机硅公司 2021-05-07 CN disclosed
CN-111032800-B Additive organopolysiloxane composition, curable composition, and film 美国陶氏有机硅公司 2021-03-12 CN disclosed
CN-112204113-A Fixing additive and preparation method and application thereof 美国陶氏有机硅公司 2021-01-08 CN disclosed
CN-111886314-A Hot melt adhesive compositions containing polyolefin-polydiorganosiloxane block copolymers and methods of making and using the same 美国陶氏有机硅公司 2020-11-03 CN disclosed
CN-111868196-A Polyorganosiloxane hot melt adhesive compositions containing polyolefin-polydiorganosiloxane copolymers and methods of making and using the same 美国陶氏有机硅公司 2020-10-30 CN disclosed
CN-111741997-A Polyolefin-polydiorganosiloxane block copolymers and hydrosilylation reaction methods for their synthesis 美国陶氏有机硅公司 2020-10-02 CN disclosed
CN-107207546-B Ligand component, related reaction product, activated reaction product, composition containing same and preparation method thereof 美国陶氏有机硅公司 2020-06-09 CN disclosed
CN-111065705-A Solventless silicone pressure sensitive adhesives and methods of making and using the same 美国陶氏有机硅公司 2020-04-24 CN disclosed
CN-111032800-A Additive organopolysiloxane composition, curable composition, and film 美国陶氏有机硅公司 2020-04-17 CN disclosed
US-5747478-A Vitamin D3 analogs for the treatment of psoriasis and sebaceous gland diseases HOFFMAN-LA ROCHE INC. (US) 1998-05-05 US disclosed