SCHEMBL725671

SCHEMBL725671

C#CC(C)(C)O[SiH](OC(C)(C)C#C)C(=C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4270321 0.72 ALDH1A1 (0.30)
SCHEMBL3697817 0.69
SCHEMBL18657169 0.69
SCHEMBL23781320 0.67
SCHEMBL8715614 0.67
SCHEMBL1253421 0.62 ALDH1A1 (0.41)
SCHEMBL6895736 0.61
SCHEMBL13593146 0.61
SCHEMBL179845 0.61
SCHEMBL28003657 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3710544-B1 HYDROSILYLATION-CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2021-08-11 EP claimed
US-20260132325-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-05-14 US disclosed
EP-4370606-B1 THERMAL CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-01-28 EP disclosed
US-20260022209-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2026-01-22 US disclosed
US-12503599-B2 Thermal conductive silicone composition DOW SILICONES CORPORATION (US) 2025-12-23 US disclosed
US-12497537-B2 Method of producing fluorosilicone rubber laminate, and fluorosilicone rubber laminate DOW TORAY CO., LTD. (JP) 2025-12-16 US disclosed
US-20250353965-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2025-11-20 US disclosed
EP-3986968-B1 THERMAL CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2025-09-03 EP disclosed
US-12378363-B2 Thermal conductive silicone composition DOW SILICONES CORPORATION (US) 2025-08-05 US disclosed
EP-3765561-B1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2025-04-30 EP disclosed
WO-2014038727-A2 CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2014-03-13 WO disclosed
US-20130161686-A1 Curable Organopolysiloxane Composition And Optical Semiconductor Device DOW CORNING TORAY CO., LTD. (JP) 2013-06-27 US disclosed
US-20130134609-A1 Curable Organopolysiloxane Composition And Optical Semiconductor Device DOW CORNING TORAY CO., LTD. (JP) 2013-05-30 US disclosed
EP-2588538-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2013-05-08 EP disclosed
EP-2588539-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2013-05-08 EP disclosed
WO-2012002561-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2012-01-05 WO disclosed
WO-2012002560-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2012-01-05 WO disclosed
US-20080262157-A1 Curable Organopolysiloxane Composition DOW CORNING TORAY COMPANY, LTD. (JP) 2008-10-23 US disclosed
US-5914192-A COMPOSITION COMPRISING POLYSILOXANES HAVING ALKENYL GROUPS AND SILICON-BONDED HYDROGEN ATOMS, ALCOHOL CONTAINING TRIPLE BOND, COMPOUND HAVING TRIPLE BOND-CONTAINING HYDROCARBON GROUPS BONDED TO SILICON THROUGH OXYGEN ATOM, PLATINUM CATALYST DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-06-22 US disclosed
EP-0845510-A2 Silicone release coating compositions Dow Corning Toray Silicone Company, Ltd. (JP) 1998-06-03 EP disclosed