SCHEMBL21409545

SCHEMBL21409545

C=CCc1cc2ccccc2c(O)c1CC=C

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.43
GABRB2 P47870 2/20 0.43
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
AKR1B1 P15121 1/20 0.38
ME2 P23368 1/20 0.38
ME1 P48163 1/20 0.38
ME3 Q16798 1/20 0.38
POLB P06746 2/20 0.37
GPR35 Q9HC97 1/20 0.37
LMNA P02545 2/20 0.37
NPC1 O15118 1/20 0.37
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37
HTT P42858 1/20 0.37
RAB9A P51151 1/20 0.37
SRD5A1 P18405 1/20 0.37
ALDH1A1 P00352 1/20 0.36
PTPN22 Q9Y2R2 1/20 0.36
TRPM4 Q8TD43 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21175462 0.86 GABRA1 (0.46) GABRA1GABRB2MEN1KMT2AAKR1B1
SCHEMBL5138488 0.84 HTR2A (0.42) GABRA1GABRB2MEN1KMT2AME2
SCHEMBL28724970 0.82 HTR2A (0.38) GABRA1GABRB2MEN1KMT2APOLB
SCHEMBL11102312 0.82 MEN1 (0.49) GABRA1GABRB2MEN1KMT2AAKR1B1
Formic Acid SCHEMBL27816451 0.81 MEN1 (0.45) GABRA1GABRB2MEN1KMT2AAKR1B1
SCHEMBL8652051 0.80 KMT2A (0.41) MEN1KMT2ALMNANPC1MAPT
SCHEMBL9088308 0.80 HTR2A (0.39) GABRA1GABRB2MEN1KMT2APOLB
SCHEMBL28723484 0.79 MEN1 (0.56) GABRA1GABRB2MEN1KMT2AAKR1B1
SCHEMBL497956 0.78 MEN1 (0.53) MEN1KMT2AME2ME1ME3
SCHEMBL9741180 0.78 ME2 (0.49) GABRA1GABRB2MEN1KMT2AME2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11901249-B2 Curable composition and cured product thereof DIC CORPORATION (JP) 2024-02-13 US disclosed
CN-112119104-B Epoxy (meth) acrylate resin composition, curable resin composition, cured product, and article DIC株式会社 2023-09-29 CN disclosed
CN-111918891-B Curable composition and cured product thereof DIC株式会社 2023-02-28 CN disclosed
CN-112105661-B Acid group-containing (meth) acrylate resin composition, curable resin composition, cured product, and resin material for solder resist DIC株式会社 2023-02-24 CN disclosed
US-11548977-B2 Active ester resin and composition and cured product using the same DIC CORPORATION (JP) 2023-01-10 US disclosed
CN-110770202-B Active ester resin, and composition and cured product using same DIC株式会社 2022-12-16 CN disclosed
CN-111936526-B Curable composition and cured product thereof DIC株式会社 2022-09-30 CN disclosed
US-20210009804-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF DIC CORPORATION (JP) 2021-01-14 US disclosed
CN-112119104-A Epoxy (meth) acrylate resin composition, curable resin composition, cured product, and article DIC株式会社 2020-12-22 CN disclosed
CN-112105661-A Acid group-containing (meth) acrylate resin composition, curable resin composition, cured product, insulating material, resin material for solder resist, and protective member DIC株式会社 2020-12-18 CN disclosed
CN-111936526-A Curable composition and cured product thereof DIC株式会社 2020-11-13 CN disclosed
CN-111918891-A Curable composition and cured product thereof DIC株式会社 2020-11-10 CN disclosed
US-20200216603-A1 ACTIVE ESTER RESIN AND COMPOSITION AND CURED PRODUCT USING THE SAME DIC CORPORATION (JP) 2020-07-09 US disclosed
CN-110770202-A Active ester resin, and composition and cured product using same DIC株式会社 2020-02-07 CN disclosed
WO-2019188331-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF DIC株式会社 2019-10-03 WO disclosed
WO-2019188330-A1 CURABLE COMPOSITION AND CURED PRODUCT OF SAME DIC株式会社 2019-10-03 WO disclosed