SCHEMBL214377

SCHEMBL214377

CCC1(C(CC(C)O)OC(CC(C)O)C2(CC)COC2)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1956858 0.77
SCHEMBL28167635 0.77
SCHEMBL1010901 0.74
SCHEMBL216525 0.74 EPHX1 (0.32)
SCHEMBL17818696 0.73
SCHEMBL28504089 0.72 EPHX1 (0.35)
SCHEMBL215758 0.72
SCHEMBL214351 0.70 ALDH1A1 (0.36)
SCHEMBL36239 0.70
SCHEMBL9918180 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 408 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US claimed
EP-4157905-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY Blue Cube IP LLC (US) 2023-04-05 EP claimed
US-20100119835-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN INTERNATIONAL LLC (US) 2010-05-13 US claimed
EP-2118197-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES Huntsman Advanced Materials (Switzerland) GmbH (CH) 2009-11-18 EP claimed
WO-2008110512-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-09-18 WO claimed
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
US-20260092142-A1 RESIN COMPOSITION, CURED PRODUCT, SCINTILLATOR PANEL, AND INDUCTOR TORAY INDUSTRIES, INC. (JP) 2026-04-02 US disclosed
EP-3787878-B1 METHODS OF POST-PROCESSING PHOTOFABRICATED ARTICLES CREATED VIA ADDITIVE FABRICATION STRATASYS INC (US) 2026-02-18 EP disclosed
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-02-10 US disclosed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
EP-4668018-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE Toray Industries, Inc. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
EP-1277776-A1 Photocurable resin composition for sealing material and method of sealing Mitsui Chemicals, Inc. (JP) 2003-01-22 EP disclosed
US-6368769-B1 PHOTOPOLYMERIZATION ASAHI DENKI KOGYO KABUSHIKI KAISHA (JP) 2002-04-09 US disclosed
US-6365644-B1 TO PROVIDE CURED PRODUCT HAVING MECHANICAL STRENGTH AND MINIMIZED SHRINKAGE DURING CURING TO ENSURE HIGH DIMENSIONAL ACCURACY DSM N.V. (NL) 2002-04-02 US disclosed
EP-1138739-A1 PHOTOCURABLE RESIN COMPOSITION FOR SEALING MATERIAL AND METHOD OF SEALING Mitsui Chemicals, Inc. (JP) 2001-10-04 EP disclosed
EP-0848294-B1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM NV (NL) 2001-09-19 EP disclosed
EP-1036789-A1 NOVEL AROMATIC SULFONIUM COMPOUNDS, PHOTOACID GENERATORS COMPRISING THE SAME, PHOTOPOLYMERIZABLE COMPOSITIONS CONTAINING THE SAME, STEREOLITHOGRAPHIC RESIN COMPOSITIONS, AND STEREOLITHOGRAPHIC PROCESS ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2000-09-20 EP disclosed
US-5981616-A OXETANE COMPOUND, EPOXY COMPOUND CONSISTING OF EXPOXIDIZED POLYMERS OF CONJUGATED DIENE MONOMERS, EXPOXIDIZED COPOLYMERS OF DIENE MONOMERS AND COMPOUNDS HAVING AN ETHYLENICALLY UNSATURATED BOND, AND EXPOXIDIZED NATURAL RUBBER DSM N.V. (NL) 1999-11-09 US disclosed
EP-0848294-A1 Photo-curable resin composition used for photo-fabrication of three-dimensional objects DSM N.V. (NL) 1998-06-17 EP disclosed