SCHEMBL214599

SCHEMBL214599

CCCCOC(C)OCC1(CC)COC1

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CTSK P43235 3/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4386323 0.88 LMNA (0.35) CTSK
SCHEMBL2991703 0.83 EPHX1 (0.31)
SCHEMBL124555 0.77 SMN1; SMN2 (0.38) CTSK
SCHEMBL12459520 0.76 TSHR (0.33) CTSK
SCHEMBL14940501 0.75 CTSK (0.34) CTSK
SCHEMBL10064031 0.74 TSHR (0.35) CTSK
SCHEMBL214598 0.74 TSHR (0.38) CTSK
SCHEMBL5702968 0.73 SMPD1 (0.35) CTSK
SCHEMBL12087304 0.73 CTSK (0.32) CTSK
SCHEMBL115527 0.73 LMNA (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 241 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US claimed
EP-4157905-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY Blue Cube IP LLC (US) 2023-04-05 EP claimed
US-20100119835-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN INTERNATIONAL LLC (US) 2010-05-13 US claimed
EP-2118197-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES Huntsman Advanced Materials (Switzerland) GmbH (CH) 2009-11-18 EP claimed
WO-2008110512-A1 PHOTOCURABLE COMPOSITIONS FOR PREPARING ABS-LIKE ARTICLES HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2008-09-18 WO claimed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
EP-4636039-A1 PHOTOCURABLE COMPOSITION, AND PHOTOCURABLE COMPOSITION FOR 3D PRINTING AND USE THEREOF Changzhou Tronly New Electronic Materials Co., Ltd (CN) 2025-10-22 EP disclosed
EP-4179024-B1 A RADIATION CURABLE COMPOSITION COMPRISING A BIOBASED REACTIVE DILUENT PERSTORP AB (SE) 2025-06-04 EP disclosed
WO-2025083094-A1 AN ELECTRON BEAM CURABLE COMPOSITION FOR PRODUCING A COIL COATING PERSTORP AB (SE) 2025-04-24 WO disclosed
WO-2024214539-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM, AND COMPOUND 日産化学株式会社 2024-10-17 WO disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
US-20030059708-A1 Resin composition and three-dimensional object DSM IP ASSETS B.V. (NL) 2003-03-27 US disclosed
EP-1295899-A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-03-26 EP disclosed
EP-1036789-B1 NOVEL AROMATIC SULFONIUM COMPOUNDS, PHOTOACID GENERATORS COMPRISING THE SAME, PHOTOPOLYMERIZABLE COMPOSITIONS CONTAINING THE SAME, STEREOLITHOGRAPHIC RESIN COMPOSITIONS, AND STEREOLITHOGRAPHIC PROCESS ASAHI DENKA KOGYO KK (JP) 2003-03-05 EP disclosed
EP-1277776-A1 Photocurable resin composition for sealing material and method of sealing Mitsui Chemicals, Inc. (JP) 2003-01-22 EP disclosed
US-20020132872-A1 Resin composition for photofabrication of three dimensional objects DSM IP ASSETS B.V. (NL) 2002-09-19 US disclosed
US-6368769-B1 PHOTOPOLYMERIZATION ASAHI DENKI KOGYO KABUSHIKI KAISHA (JP) 2002-04-09 US disclosed
EP-1138739-A1 PHOTOCURABLE RESIN COMPOSITION FOR SEALING MATERIAL AND METHOD OF SEALING Mitsui Chemicals, Inc. (JP) 2001-10-04 EP disclosed
EP-1036789-A1 NOVEL AROMATIC SULFONIUM COMPOUNDS, PHOTOACID GENERATORS COMPRISING THE SAME, PHOTOPOLYMERIZABLE COMPOSITIONS CONTAINING THE SAME, STEREOLITHOGRAPHIC RESIN COMPOSITIONS, AND STEREOLITHOGRAPHIC PROCESS ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2000-09-20 EP disclosed