Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.56 |
| ▸ | TSHR | P16473 | 1/20 | 0.56 |
| ▸ | THRB | P10828 | 2/20 | 0.53 |
| ▸ | THRA | P10827 | 1/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.52 |
| ▸ | ESR1 | P03372 | 2/20 | 0.52 |
| ▸ | ADRA2A | P08913 | 2/20 | 0.52 |
| ▸ | ADORA3 | P0DMS8 | 2/20 | 0.52 |
| ▸ | TACR2 | P21452 | 2/20 | 0.52 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.52 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.52 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.52 |
| ▸ | LMNA | P02545 | 2/20 | 0.52 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.52 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.52 |
| ▸ | SHBG | P04278 | 1/20 | 0.52 |
| ▸ | TP53 | P04637 | 1/20 | 0.52 |
| ▸ | HSPD1 | P10809 | 1/20 | 0.52 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.52 |
| ▸ | HTR2C | P28335 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2414845 | 1.00 | HSD17B10 (0.56) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL21462968 | 1.00 | HSD17B10 (0.56) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL21462959 | 1.00 | HSD17B10 (0.56) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL28162292 | 0.98 | HSD17B10 (0.53) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL12864617 | 0.93 | HSD17B10 (0.46) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL22139934 | 0.85 | TSHR (0.50) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL237570 | 0.85 | THRB (0.44) | HSD17B10TSHRTHRBALDH1A1LMNA | |
| SCHEMBL10401975 | 0.85 | CALM1 (0.44) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL2096762 | 0.82 | THRB (0.56) | HSD17B10TSHRTHRBTHRAALDH1A1 | |
| SCHEMBL6265892 | 0.82 | THRB (0.60) | HSD17B10TSHRTHRBTHRAALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115175951-B | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-118043384-A | Prepreg, laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500850-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117355545-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-116940617-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116888189-A | Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-10-13 | — | — | CN | disclosed |
| CN-116829619-A | Resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-107406577-A | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2017-11-28 | — | — | CN | disclosed |
| CN-107406582-A | Cyanate ester compound, curable resin composition containing the same, and cured product thereof | 三菱瓦斯化学株式会社 | 2017-11-28 | — | — | CN | disclosed |
| CN-107207855-A | Resin composition for printed circuit board, prepreg, resin compounded piece and clad with metal foil plywood | 三菱瓦斯化学株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107207834-A | Resin composition for printed circuit board, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-107075090-A | Cyanate esters and its manufacture method, resin combination and solidfied material | 三菱瓦斯化学株式会社 | 2017-08-18 | — | — | CN | disclosed |
| CN-107001767-A | Resin combination, prepreg, clad with metal foil plywood, resin compounded piece and printed circuit board (PCB) | 三菱瓦斯化学株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-104755422-B | Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition | 三菱瓦斯化学株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-105683154-A | Cyanate ester compound, curable resin composition containing the same, and cured product thereof | 三菱瓦斯化学株式会社 | 2016-06-15 | — | — | CN | disclosed |
| CN-104755422-A | Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition | MITSUBISHI GAS CHEMICAL CO | 2015-07-01 | — | — | CN | disclosed |
| CN-103347930-B | Curable resin composition and cured product thereof | MITSUBISHI GAS CHEMICAL CO | 2015-06-24 | — | — | CN | disclosed |