Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.44 |
| ▸ | LPL | P06858 | 1/20 | 0.41 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.40 |
| ▸ | MGLL | Q99685 | 1/20 | 0.40 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | PLA2G1B | P04054 | 1/20 | 0.38 |
| ▸ | ATG4B | Q9Y4P1 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.37 |
| ▸ | RAB9A | P51151 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.37 |
| ▸ | PPARG | P37231 | 1/20 | 0.36 |
| ▸ | PPARA | Q07869 | 1/20 | 0.36 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.36 |
| ▸ | PLK1 | P53350 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12864617 | 0.88 | HSD17B10 (0.46) | THRBALDH1A1CA2KMT2AMEN1 | |
| SCHEMBL4261692 | 0.87 | P2RY6 (0.38) | TAAR1 | |
| SCHEMBL28162292 | 0.86 | HSD17B10 (0.53) | THRBLPLLIPGALDH1A1MGLL | |
| SCHEMBL21462953 | 0.85 | HSD17B10 (0.56) | THRBLPLLIPGALDH1A1MGLL | |
| SCHEMBL21462968 | 0.85 | HSD17B10 (0.56) | THRBLPLLIPGALDH1A1MGLL | |
| SCHEMBL21462959 | 0.85 | HSD17B10 (0.56) | THRBLPLLIPGALDH1A1MGLL | |
| SCHEMBL2414845 | 0.85 | HSD17B10 (0.56) | THRBLPLLIPGALDH1A1MGLL | |
| SCHEMBL3810021 | 0.83 | CYP2A6 (0.52) | LPLLIPGALDH1A1MGLLKMT2A | |
| SCHEMBL10401975 | 0.83 | CALM1 (0.44) | THRBALDH1A1TSHRHSD17B10PPARG | |
| SCHEMBL2095671 | 0.79 | THRB (0.49) | THRBLPLLIPGALDH1A1MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 739 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116635571-A | Dielectric film forming composition | 富士胶片电子材料美国有限公司 | 2023-08-22 | — | — | CN | claimed |
| CN-115851197-A | Thermosetting resin composition and insulating adhesive film | 广东生益科技股份有限公司 | 2023-03-28 | — | — | CN | claimed |
| CN-111087809-B | Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same | 台燿科技股份有限公司 | 2022-09-13 | — | — | CN | claimed |
| CN-110885428-B | Halogen-free thermosetting resin composition, prepreg using same, laminated board and printed circuit board | 广东生益科技股份有限公司 | 2022-06-28 | — | — | CN | claimed |
| CN-110240803-B | High-frequency resin composite material composition, protective film and copper-clad plate | 江阴骏驰新材料科技有限公司 | 2021-11-30 | — | — | CN | claimed |
| CN-109337289-B | Thermosetting resin composition, prepreg, laminate and high-frequency circuit board containing the same | 广东生益科技股份有限公司 | 2021-10-19 | — | — | CN | claimed |
| CN-109810517-B | Resin composition, prepreg for printed circuit, and metal-clad laminate | 广东生益科技股份有限公司 | 2021-08-27 | — | — | CN | claimed |
| CN-108350145-B | Cyanate ester dual cure resin for additive manufacturing | 卡本有限公司 | 2021-06-22 | — | — | CN | claimed |
| CN-109808259-B | High-frequency double-sided copper-clad plate and preparation method and application thereof | 江阴骏驰新材料科技有限公司 | 2021-04-30 | — | — | CN | claimed |
| CN-108117723-B | Thermosetting resin composition, prepreg using same and laminated board for printed circuit | 广东生益科技股份有限公司 | 2020-09-08 | — | — | CN | claimed |
| CN-1197893-C | Thermosetting resin compositions useful as underfill sealants | LOCTITE CORP (US) | 2005-04-20 | — | — | CN | claimed |
| US-6632893-B2 | Used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected | HENKEL LOCTITE CORPORATION | 2003-10-14 | — | — | US | claimed |
| JP-2001506313-A | — | — | 2001-05-15 | — | — | JP | claimed |
| EP-0929592-A4 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORP (US) | 2000-09-13 | — | — | EP | claimed |
| CN-1237186-A | Thermosetting resin compositions useful as underfill sealants | LOCTITE CORP (US) | 1999-12-01 | — | — | CN | claimed |
| EP-0929592-A1 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORPORATION (US) | 1999-07-21 | — | — | EP | claimed |
| WO-1999005196-A1 | THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS | LOCTITE CORPORATION (US) | 1999-02-04 | — | — | WO | claimed |
| US-5003013-A | Intermediate for composite of polymaleimide, polycyanate, epoxy resin and polyester | MITSUBISHI RAYON CO., LTD. (JP) | 1991-03-26 | — | — | US | claimed |
| EP-0321412-A2 | Di- or polycyanate compounds, substituted bicyclo[2.2.1]5 heptene-dicarbon imides, blends containing thermoplastics, and their use | CIBA-GEIGY AG (CH) | 1989-06-21 | — | — | EP | claimed |
| EP-0005342-B1 | THERMOFORMABLE COMPOSITION CONTAINING A CROSS-LINKED CYANURATE POLYMER, AND A PROCESS FOR PRODUCING SAME | ALLIED CORPORATION (US) | 1983-08-24 | — | — | EP | claimed |