SCHEMBL2156403

SCHEMBL2156403

COC(OC)[SiH2]CCCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28228284 0.84
SCHEMBL646422 0.84
SCHEMBL704741 0.84
SCHEMBL1920971 0.81
SCHEMBL558284 0.81
SCHEMBL17373020 0.81
SCHEMBL5420624 0.78
SCHEMBL331418 0.78
SCHEMBL3655928 0.77 CA1 (0.31)
SCHEMBL2967870 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3782599-B1 DENTAL POLYMERIZABLE COMPOSITION BASED ON CONDENSED SILANES VOCO GMBH (DE) 2025-09-17 EP disclosed
CN-118804953-A Curable composition and use thereof 株式会社钟化 2024-10-18 CN disclosed
CN-118574899-A Curable composition and use thereof 株式会社钟化 2024-08-30 CN disclosed
US-11992538-B2 Polymerizable dental composition based on condensed silanes VOCO GMBH (DE) 2024-05-28 US disclosed
CN-115380081-B Curable composition 株式会社钟化 2024-05-24 CN disclosed
WO-2024071051-A1 CURABLE COMPOSITION 株式会社カネカ 2024-04-04 WO disclosed
WO-2023162664-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-31 WO disclosed
WO-2023145711-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-03 WO disclosed
WO-2023074462-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR 株式会社カネカ 2023-05-04 WO disclosed
WO-2023054700-A1 CURABLE COMPOSITION 株式会社カネカ 2023-04-06 WO disclosed
US-20090075096-A1 Organoalkoxysilanes SIKA TECHNOLOGY AG (CH) 2009-03-19 US disclosed
US-20080319152-A1 Curable Composition KANEKA CORPORATION (JP) 2008-12-25 US disclosed
EP-1985666-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-10-29 EP disclosed
US-20070055038-A1 Adducts containing isocyanate groups and composition adhering effectively to painted substrates SIKA TECHNOLOGY AG (CH) 2007-03-08 US disclosed
EP-1760100-A1 Isocyanate group containing adducts and compositions having good adhesion on coated substrates Sika Technology AG (CH) 2007-03-07 EP disclosed
CN-1923804-A Adducts containing isocyanate groups and composition adhering effectively to painted substrates SIKA TECHNOLOGY AG (CH) 2007-03-07 CN disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1717240-A1 Organoalkoxysilanes for use in moisture curable compositions Sika Technology AG (CH) 2006-11-02 EP disclosed
EP-1636649-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS FujiFilm Electronic Materials USA, Inc. (US) 2006-03-22 EP disclosed
WO-2004111726-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2004-12-23 WO disclosed