⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1920971 | 0.97 | — | — | |
| SCHEMBL17373020 | 0.97 | — | — | |
| SCHEMBL646422 | 0.94 | — | — | |
| SCHEMBL56327 | 0.87 | NFKB1 (0.33) | — | |
| SCHEMBL5406950 | 0.87 | — | — | |
| SCHEMBL17750065 | 0.87 | TSHR (0.38) | — | |
| SCHEMBL17750050 | 0.87 | TSHR (0.38) | — | |
| SCHEMBL12805406 | 0.87 | TSHR (0.38) | — | |
| SCHEMBL8467119 | 0.87 | ALDH1A1 (0.31) | — | |
| SCHEMBL8466931 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114846374-B | Optical laminate and image display device | 住友化学株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-114450375-B | Adhesive composition | 住友化学株式会社 | 2024-10-25 | — | — | CN | disclosed |
| WO-2024150783-A1 | ADHESIVE COMPOSITION, ADHESIVE LAYER, OPTICAL FILM WITH ADHESIVE LAYER, AND DISPLAY DEVICE | 住友化学株式会社 | 2024-07-18 | — | — | WO | disclosed |
| CN-113825811-B | Adhesive composition | 住友化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117310849-A | Optical laminate | 住友化学株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-114502680-B | Adhesive composition | 住友化学株式会社 | 2023-12-01 | — | — | CN | disclosed |
| CN-112566949-B | Resin and adhesive composition | 住友化学株式会社 | 2023-06-23 | — | — | CN | disclosed |
| CN-110249019-B | Adhesive composition | 住友化学株式会社 | 2023-05-26 | — | — | CN | disclosed |
| CN-113474688-B | Optical layer and laminate comprising same | 住友化学株式会社 | 2023-05-12 | — | — | CN | disclosed |
| US-11592945-B2 | Dielectric siloxane particle films and devices having the same | INKRON OY (FI) | 2023-02-28 | — | — | US | disclosed |
| EP-3158005-A1 | COMPOSITION HAVING SILOXANE POLYMER AND PARTICLE | Inkron OY (FI) | 2017-04-26 | — | — | EP | disclosed |
| WO-2017060572-A1 | ELECTRICALLY CONDUCTIVE SILOXANE PARTICLE FILMS, AND DEVICES WITH THE SAME | INKRON OY (FI) | 2017-04-13 | — | — | WO | disclosed |
| WO-2015193558-A1 | A METHOD OF MAKING A SILOXANE POLYMER COMPOSITION | INKRON OY (FI) | 2015-12-23 | — | — | WO | disclosed |
| WO-2015193554-A1 | TRANSPARENT SILOXANE ENCAPSULANT AND ADHESIVE | INKRON OY (FI) | 2015-12-23 | — | — | WO | disclosed |
| WO-2015193556-A1 | COMPOSITION HAVING SILOXANE POLYMER AND PARTICLE | INKRON OY (FI) | 2015-12-23 | — | — | WO | disclosed |
| WO-2015193557-A1 | DIELECTRIC SILOXANE PARTICLE FILMS, AND DEVICES HAVING THE SAME | INKRON OY (FI) | 2015-12-23 | — | — | WO | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |