SCHEMBL21572865

SCHEMBL21572865

CC(CC=O)N1CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11608930 0.91 MC4R (0.34)
SCHEMBL8903526 0.90 ALDH1A1 (0.34)
SCHEMBL8903621 0.88 ALDH1A1 (0.33)
SCHEMBL8903510 0.84 FDPS (0.36)
SCHEMBL11729034 0.84 LMNA (0.39)
SCHEMBL5546488 0.78 KDM4E (0.40)
SCHEMBL5498252 0.69 GPR183 (0.36)
SCHEMBL29958077 0.67 CHRM2 (0.36)
SCHEMBL14145603 0.67 HSD17B10 (0.41)
SCHEMBL13632334 0.67 HSD17B10 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210189212-A1 CONTROL CURE THERMALLY-CONDUCTIVE GAP FILLER MATERIALS 3M INNOVATIVE PROPERTIES COMPANY 2021-06-24 US disclosed
EP-3570296-A1 THERMALLY-CONDUCTIVE GAP FILLER 3M Innovative Properties Company (US) 2019-11-20 EP disclosed