SCHEMBL216358

SCHEMBL216358

[c]1ccccc1CCc1[c]cccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3450884 0.89 HTR2A (0.30)
SCHEMBL2528409 0.89 MAOA (0.31)
SCHEMBL158396 0.88 MAOA (0.43)
SCHEMBL11863151 0.87 SIGMAR1 (0.32)
SCHEMBL931698 0.85
SCHEMBL1058725 0.85
SCHEMBL17730 0.85
SCHEMBL310013 0.85
SCHEMBL3283578 0.85
SCHEMBL2139341 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 326 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4238613-A IMPARTING PHOTOSTABILITY AND OXIDATION AND HEAT RESISTANCE TO PLASTICS CIBA-GEIGY CORPORATION (US) 1980-12-09 US claimed
EP-3859447-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2021-08-04 EP disclosed
CN-112639616-A Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2021-04-09 CN disclosed
US-RE48302-E1 Embolic compositions BIOCURE, INC. (US) 2020-11-10 US disclosed
CN-110366571-B Modified resin and curable resin composition containing the same 协立化学产业株式会社 2020-09-18 CN disclosed
CN-110366570-B (meth) acrylate resin and curable resin composition containing same 协立化学产业株式会社 2020-09-15 CN disclosed
WO-2020066416-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed
US-RE47873-E1 Embolic compositions BIOCOMPATIBLES UK LIMITED (GB) 2020-02-25 US disclosed
WO-2019202795-A1 ORGANIC SILICON COMPOUND AND PRODUCTION METHOD THEREFOR 信越化学工業株式会社 2019-10-24 WO disclosed
CN-110366570-A (methyl) acrylate and hardening resin composition comprising (methyl) acrylate 协立化学产业株式会社 2019-10-22 CN disclosed
EP-0668294-A1 Unsaturated carbohydrate derivatives, polymers therefrom and their application CIBA-GEIGY AG (CH) 1995-08-23 EP disclosed
EP-0641806-A2 Photocrosslinked polymers CIBA-GEIGY AG (CH) 1995-03-08 EP disclosed
EP-0637491-A1 Process and device for the production of moulded objects as well as objects produced by this process CIBA-GEIGY AG (CH) 1995-02-08 EP disclosed
EP-0637490-A1 Process and device for production of moulded parts as well as the so manufactured parts CIBA-GEIGY AG (CH) 1995-02-08 EP disclosed
WO-1994015575-A1 HAIRSPRAY FORMULATIONS EASTMAN CHEMICAL COMPANY (US) 1994-07-21 WO disclosed
EP-0598084-A1 COMPOUNDS CAPABLE OF FORMING INCLUSION COMPLEXES. KODAK LTD (GB) 1994-05-25 EP disclosed
EP-0216074-B1 POLYVINYL ALCOHOL DERIVATIVES AND CROSSLINKED HYDROGEL CONTACT LENSES MADE THEREFROM CIBA-GEIGY AG (CH) 1993-06-16 EP disclosed
EP-0216074-A2 Polyvinyl alcohol derivatives and crosslinked hydrogel contact lenses made therefrom CIBA-GEIGY AG (CH) 1987-04-01 EP disclosed
US-4238613-A IMPARTING PHOTOSTABILITY AND OXIDATION AND HEAT RESISTANCE TO PLASTICS CIBA-GEIGY CORPORATION (US) 1980-12-09 US disclosed
US-3981865-A BACTERICIDES TOYAMA CHEMICAL CO., LTD. (JA) 1976-09-21 US disclosed