SCHEMBL21662876

SCHEMBL21662876

CC1(C)Nc2ccccc2-c2ccccc21

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.47
HSD17B10 Q99714 3/20 0.47
CYP3A4 P08684 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
KDM4E B2RXH2 6/20 0.46
HPGD P15428 3/20 0.46
MEN1 O00255 1/20 0.46
KMT2A Q03164 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
NOS2 P35228 2/20 0.44
PDK2 Q15119 1/20 0.41
PDK4 Q16654 1/20 0.41
HTT P42858 1/20 0.39
ITGA4 P13612 1/20 0.38
POLB P06746 1/20 0.38
HTR5A P47898 2/20 0.37
MAOA P21397 1/20 0.34
MAOB P27338 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22010250 0.81 PDK2 (0.46) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL14392692 0.77 PDK2 (0.39) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL29976483 0.76 NOS2 (0.43) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL28555391 0.76 NOS2 (0.43) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL13469502 0.74 ALDH1A1 (0.52) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL21663068 0.74 KMT2A (0.43) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL2144205 0.74 GSK3B (0.46) ALDH1A1HSD17B10KDM4EHPGDPDK2
SCHEMBL17867071 0.72 ALDH1A1 (0.42) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL18403613 0.68 PDK2 (0.43) ALDH1A1HSD17B10CYP3A4TDP1KDM4E
SCHEMBL25365206 0.68 PDK2 (0.44) ALDH1A1HSD17B10CYP3A4TDP1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed