SCHEMBL21751177

SCHEMBL21751177

C#Cc1ccc(C=Cc2ccccc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MAOB P27338 3/20 0.50
NFE2L2 Q16236 2/20 0.50
CYP19A1 P11511 2/20 0.50
MAOA P21397 2/20 0.50
RELA Q04206 3/20 0.45
TRPA1 O75762 1/20 0.45
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
FFAR1 O14842 1/20 0.42
CHAT P28329 1/20 0.41
HDAC1 Q13547 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21751176 1.00 MAOB (0.50) MAOBNFE2L2CYP19A1MAOARELA
SCHEMBL6005614 0.90 HDAC8 (0.43) MAOBNFE2L2CYP19A1MAOAFFAR1
SCHEMBL6005617 0.90 HDAC8 (0.43) MAOBNFE2L2CYP19A1MAOAFFAR1
SCHEMBL5892551 0.90 HDAC8 (0.43) MAOBNFE2L2CYP19A1MAOAFFAR1
SCHEMBL5892375 0.90 HDAC8 (0.43) MAOBNFE2L2CYP19A1MAOAFFAR1
SCHEMBL2601889 0.84 RELA (0.46) MAOBNFE2L2CYP19A1MAOARELA
Benzaldehyde SCHEMBL6862921 0.82 ALDH1A1 (0.61) TRPA1KMT2AFFAR1
SCHEMBL11548470 0.80 FFAR1 (0.61) MAOBNFE2L2CYP19A1MAOARELA
SCHEMBL10070037 0.79 CYP2A6 (0.41)
SCHEMBL22164138 0.79 NFE2L2 (0.72) MAOBNFE2L2CYP19A1MAOARELA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250115691-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO LTD (KR) 2025-04-10 US disclosed
US-20230406970-A1 METHOD OF FORMING PATTERNS SAMSUNG SDI CO LTD (KR) 2023-12-21 US disclosed
CN-110845649-B Polymer, organic layer composition, and method of forming pattern 三星SDI株式会社 2023-06-06 CN disclosed
CN-110845649-A Polymer, organic layer composition and method of forming pattern 三星SDI株式会社 2020-02-28 CN disclosed
US-20200062875-A1 POLYMER, ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2020-02-27 US disclosed