Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 3/20 | 0.57 |
| ▸ | CA1 | P00915 | 3/20 | 0.57 |
| ▸ | CA2 | P00918 | 3/20 | 0.57 |
| ▸ | CA9 | Q16790 | 3/20 | 0.57 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.57 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.41 |
| ▸ | STAT3 | P40763 | 2/20 | 0.40 |
| ▸ | LIPC | P11150 | 4/20 | 0.38 |
| ▸ | LIPG | Q9Y5X9 | 4/20 | 0.38 |
| ▸ | EGFR | P00533 | 2/20 | 0.37 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.36 |
| ▸ | GABRG2 | P18507 | 1/20 | 0.36 |
| ▸ | GABRB3 | P28472 | 1/20 | 0.36 |
| ▸ | GABRA3 | P34903 | 1/20 | 0.36 |
| ▸ | GABRA2 | P47869 | 1/20 | 0.36 |
| ▸ | RXRA | P19793 | 1/20 | 0.36 |
| ▸ | RXRB | P28702 | 1/20 | 0.36 |
| ▸ | RXRG | P48443 | 1/20 | 0.36 |
| ▸ | ABCG2 | Q9UNQ0 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24581543 | 0.95 | CA12 (0.52) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23208393 | 0.90 | CA12 (0.52) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23432948 | 0.84 | CA1 (0.54) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23432939 | 0.83 | CA12 (0.43) | CA12CA1CA2CA9CA14 | |
| SCHEMBL21794138 | 0.81 | ELANE (0.50) | CA12CA1CA2CA9CA14 | |
| SCHEMBL6350965 | 0.79 | CA12 (0.71) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23432774 | 0.79 | EGFR (0.62) | CA12CA1CA2CA9CA14 | |
| SCHEMBL21794096 | 0.78 | PDE5A (0.36) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23812256 | 0.75 | CA12 (0.66) | CA12CA1CA2CA9CA14 | |
| SCHEMBL23432950 | 0.75 | SMN1; SMN2 (0.53) | RXRARXRBIKBKBMAPK12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023162837-A1 | POSITIVE ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND | 富士フイルム株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023162838-A1 | ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230038825-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FOR MANUFACTURING PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK | FUJIFILM CORPORATION (JP) | 2023-02-09 | — | — | US | disclosed |
| EP-4130878-A1 | ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FOR MANUFACTURING PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK | FUJIFILM Corporation (JP) | 2023-02-08 | — | — | EP | disclosed |
| WO-2023008347-A1 | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | 富士フイルム株式会社 | 2023-02-02 | — | — | WO | disclosed |
| US-20210165325-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND | FUJIFILM CORPORATION (JP) | 2021-06-03 | — | — | US | disclosed |
| WO-2020045534-A1 | ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND | 富士フイルム株式会社 | 2020-03-05 | — | — | WO | disclosed |