SCHEMBL21794096

SCHEMBL21794096

CC(C)(C)Oc1ccc(-c2cc(-c3ccc(OC(C)(C)C)cc3)c(S(=O)(=O)O)c(-c3ccc(OC(C)(C)C)cc3)c2)cc1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PDE5A O76074 1/20 0.36
▸ MAP4K4 O95819 1/20 0.36
▸ KCNH2 Q12809 1/20 0.36
▸ MINK1 Q8N4C8 1/20 0.36
▸ PRKAB2 O43741 1/20 0.35
▸ PRKAG1 P54619 1/20 0.35
▸ PRKAA2 P54646 1/20 0.35
▸ PRKAA1 Q13131 1/20 0.35
▸ PRKAG3 Q9UGI9 1/20 0.35
▸ PRKAG2 Q9UGJ0 1/20 0.35
▸ PRKAB1 Q9Y478 1/20 0.35
▸ KIF11 P52732 1/20 0.35
▸ PPARG P37231 5/20 0.34
▸ PPARA Q07869 5/20 0.34
▸ PPARD Q03181 2/20 0.34
▸ CYP2C9 P11712 1/20 0.34
▸ CYP2C19 P33261 1/20 0.34
▸ RIPK1 Q13546 1/20 0.33
▸ AURKA O14965 1/20 0.33
▸ TPX2 Q9ULW0 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21794146 0.82 SMN1; SMN2 (0.50) MAP4K4PRKAB2PRKAG1PRKAA2PRKAA1
SCHEMBL21794138 0.81 ELANE (0.50) PDE5AMAP4K4KCNH2MINK1PRKAB2
SCHEMBL21794099 0.78 HSD17B10 (0.50) TP53SMN1; SMN2CA2
SCHEMBL21794097 0.78 CA12 (0.57) CA12CA1CA2CA9CA14
SCHEMBL23432887 0.77 PRKAB2 (0.34) MAP4K4PRKAB2PRKAG1PRKAA2PRKAA1
SCHEMBL24995338 0.76 ERN1 (0.36) MAP4K4PRKAB2PRKAG1PRKAA2PRKAA1
SCHEMBL21794137 0.76 FYN (0.49) MAP4K4PRKAB2PRKAG1PRKAA2PRKAA1
SCHEMBL23432890 0.75 KIF11 (0.38) KIF11AURKATPX2CA1CA2
SCHEMBL21794266 0.74 ESR1 (0.50) MAP4K4MINK1ABCB1
SCHEMBL25006154 0.74 CYP1A2 (0.44) MAP4K4PPARGPPARACYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162837-A1 POSITIVE ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND 富士フイルム株式会社 2023-08-31 — — WO disclosed
WO-2023162838-A1 ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 — — WO disclosed
WO-2023008347-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2023-02-02 — — WO disclosed
US-20210165325-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-06-03 — — US disclosed
WO-2020045534-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND 富士フイルム株式会社 2020-03-05 — — WO disclosed
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