SCHEMBL21808151

SCHEMBL21808151

Nc1ccc(C(=O)c2ccccc2)c(Oc2ccccc2)c1Oc1ccccc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.51
GAA P10253 1/20 0.51
CCNE2 O96020 1/20 0.49
CCNE1 P24864 1/20 0.49
CDK2 P24941 1/20 0.49
POLB P06746 2/20 0.49
LMNA P02545 3/20 0.46
ALDH1A1 P00352 2/20 0.46
MEN1 O00255 1/20 0.46
USP2 O75604 1/20 0.46
GLA P06280 1/20 0.46
KMT2A Q03164 1/20 0.46
HSD17B10 Q99714 1/20 0.46
SRD5A2 P31213 3/20 0.45
MAPK1 P28482 3/20 0.42
HTT P42858 2/20 0.42
TSHR P16473 1/20 0.42
PARP10 Q53GL7 1/20 0.42
CYP1A2 P05177 1/20 0.42
PGR P06401 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26135851 0.92 POLB (0.45) MAPTGAACCNE2CCNE1CDK2
SCHEMBL25437438 0.89 CTNNB1 (0.45) MAPTGAACCNE2CCNE1CDK2
SCHEMBL27737105 0.87 MAPT (0.61) MAPTGAACCNE2CCNE1CDK2
SCHEMBL9063955 0.85 POLB (0.50) MAPTGAACCNE2CCNE1CDK2
SCHEMBL4782239 0.85 CCNE2 (0.48) MAPTGAACCNE2CCNE1CDK2
SCHEMBL9859607 0.84 MAPT (0.61) MAPTGAACCNE2CCNE1CDK2
SCHEMBL28599276 0.81 MAPT (0.49) MAPTGAACCNE2CCNE1CDK2
SCHEMBL28340608 0.81 MAPT (0.49) MAPTGAACCNE2CCNE1CDK2
SCHEMBL30170492 0.81 MAPT (0.45) MAPTGAAPOLBLMNAALDH1A1
SCHEMBL28609067 0.80 CTNNB1 (0.42) MAPTGAACCNE2CCNE1CDK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113950409-B Laminate body 东洋纺株式会社 2024-06-28 CN disclosed
CN-118119507-A Laminate of inorganic substrate with protective film and heat-resistant polymer film 东洋纺株式会社 2024-05-31 CN disclosed
CN-118076482-A Laminate with protective film-assisted release tape 东洋纺株式会社 2024-05-24 CN disclosed
CN-117916856-A Semiconductor device and method for manufacturing semiconductor device 国立大学法人筑波大学 2024-04-19 CN disclosed
CN-117866200-A Polybenzoxazole precursor, process for producing the same, and photosensitive resin composition 上海交通大学 2024-04-12 CN disclosed
CN-117836134-A Laminate body 东洋纺株式会社 2024-04-05 CN disclosed
CN-117677497-A Laminate of inorganic substrate and heat-resistant polymer film 东洋纺株式会社 2024-03-08 CN disclosed
CN-117677496-A Laminate of inorganic substrate and transparent heat-resistant polymer film 东洋纺株式会社 2024-03-08 CN disclosed
CN-115175816-B Laminate body 东洋纺株式会社 2024-03-08 CN disclosed
CN-117642286-A Laminate roll 东洋纺株式会社 2024-03-01 CN disclosed
CN-113518792-B Polybenzoxazole precursor containing ester diamine, photosensitive resin composition, dry film, cured product, and electronic component 太阳控股株式会社 2023-08-15 CN disclosed
CN-116137837-A Polyimide film and method for producing same 东洋纺株式会社 2023-05-19 CN disclosed
CN-116133854-A Polyimide film and method for producing same 东洋纺株式会社 2023-05-16 CN disclosed
CN-115996840-A Laminate and method for manufacturing flexible device 东洋纺株式会社 2023-04-21 CN disclosed
CN-112512792-B Laminate and method for producing laminate 东洋纺株式会社 2023-02-17 CN disclosed
CN-115667379-A Resin film and method for producing resin film 东洋纺株式会社 2023-01-31 CN disclosed
CN-115551714-A Laminate comprising transparent highly heat-resistant film 东洋纺株式会社 2022-12-30 CN disclosed
CN-115515790-A Colorless multilayer polyimide film, laminate, and method for manufacturing flexible electronic device 东洋纺株式会社 2022-12-23 CN disclosed
CN-115461221-A Polyimide film and method for producing same 东洋纺株式会社 2022-12-09 CN disclosed
WO-2020059508-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT 太陽ホールディングス株式会社 2020-03-26 WO disclosed