SCHEMBL21811859

SCHEMBL21811859

Cn1cnnc1-c1cccnc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 8/20 0.50
ALDH1A1 P00352 4/20 0.50
CYP2A13 Q16696 1/20 0.50
CYP3A4 P08684 3/20 0.48
CYP1A2 P05177 2/20 0.48
CYP2C9 P11712 2/20 0.47
CYP2C19 P33261 2/20 0.47
CYP2E1 P05181 1/20 0.47
CYP2B6 P20813 1/20 0.47
HTT P42858 2/20 0.47
HSD17B10 Q99714 2/20 0.47
MAPT P10636 2/20 0.47
KDM4E B2RXH2 1/20 0.47
LMNA P02545 1/20 0.47
TP53 P04637 1/20 0.47
HPGD P15428 1/20 0.47
ALOX15 P16050 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
GAA P10253 1/20 0.45
L3MBTL1 Q9Y468 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28018626 0.80 CYP2A6 (0.50) CYP2A6ALDH1A1CYP3A4CYP1A2CYP2C9
SCHEMBL30525939 0.80 CYP2A6 (0.50) CYP2A6ALDH1A1CYP3A4CYP1A2CYP2C9
SCHEMBL3658697 0.79 L3MBTL1 (0.59) ALDH1A1HSD17B10KDM4ELMNAHPGD
SCHEMBL15147819 0.78 MAP3K5 (0.60) CYP2A6ALDH1A1CYP3A4CYP1A2CYP2C9
SCHEMBL21408693 0.78 PCSK9 (0.37) ALDH1A1LMNASMN1; SMN2GAAL3MBTL1
SCHEMBL2451213 0.77 L3MBTL1 (0.49) ALDH1A1CYP1A2HSD17B10MAPTKDM4E
SCHEMBL24484007 0.76 PCSK9 (0.44) NPC1RAB9A
SCHEMBL19219072 0.74 L3MBTL1 (0.46) ALDH1A1CYP1A2MAPTKDM4ELMNA
SCHEMBL11984411 0.74 MAPK14 (0.51) ALDH1A1HSD17B10MAPTLMNATP53
SCHEMBL22575387 0.73 PCSK9 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4692940-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD Sumitomo Bakelite Co., Ltd. (JP) 2026-02-11 EP disclosed
CN-112689800-B Photosensitive resin composition for forming permanent film, cured film, electronic device, and method for producing same 住友电木株式会社 2024-07-30 CN disclosed
CN-110914756-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2021-05-04 CN disclosed
CN-112689800-A Photosensitive resin composition for forming permanent film, cured film, electronic device, method for producing cured film, and method for producing electronic device 住友电木株式会社 2021-04-20 CN disclosed
CN-110809737-B Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-11-17 CN disclosed
CN-110914756-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-03-24 CN disclosed
WO-2020054644-A1 PERMANENT FILM-FORMING PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, CURED FILM PRODUCTION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 住友ベークライト株式会社 2020-03-19 WO disclosed
CN-110809737-A Photosensitive resin composition, resin film, and electronic device 住友电木株式会社 2020-02-18 CN disclosed