SCHEMBL2189181

SCHEMBL2189181

CC#Cc1cc(C#CC)cc(C23CC4CC(C2)CC(C25CC6(c7cc(C#CC)cc(C#CC)c7)CC(c7cc(C#CC)cc(C#CC)c7)(CC(c7cc(C#CC)cc(C#CC)c7)(C6)C2)C5)(C4)C3)c1

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
PGR P06401 10/20 0.43
ALDH1A1 P00352 3/20 0.36
LMNA P02545 2/20 0.34
ESR1 P03372 1/20 0.34
GRIN2D O15399 1/20 0.32
GRIN3B O60391 1/20 0.32
GRIN1 Q05586 1/20 0.32
GRIN2A Q12879 1/20 0.32
GRIN2B Q13224 1/20 0.32
GRIN2C Q14957 1/20 0.32
GRIN3A Q8TCU5 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2188872 0.96 PGR (0.42) PGRALDH1A1LMNAESR1GRIN2D
SCHEMBL2188045 0.93 PGR (0.42) PGRALDH1A1LMNAESR1GRIN2D
SCHEMBL2190193 0.88 PGR (0.33) PGR
SCHEMBL2192828 0.86 PGR (0.37) PGRALDH1A1LMNA
SCHEMBL2187183 0.85 PGR (0.34) PGR
SCHEMBL2189655 0.84
SCHEMBL2188546 0.83 GRIN2D (0.42) PGRALDH1A1LMNAESR1GRIN2D
SCHEMBL4064832 0.83 PGR (0.37) PGRALDH1A1LMNAESR1GRIN2D
SCHEMBL2189735 0.82 PGR (0.41) PGRALDH1A1LMNAESR1GRIN2D
SCHEMBL4052728 0.81 PGR (0.35) PGRALDH1A1LMNAESR1GRIN2D

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed