SCHEMBL2188992

SCHEMBL2188992

C(#Cc1[c]cccc1C#Cc1ccccc1)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.48
CYP1A2 P05177 4/20 0.48
CYP3A4 P08684 4/20 0.48
CYP2C9 P11712 4/20 0.48
CYP2C19 P33261 4/20 0.48
MAPT P10636 3/20 0.48
NPC1 O15118 3/20 0.48
MEN1 O00255 3/20 0.48
HPGD P15428 3/20 0.48
KMT2A Q03164 3/20 0.48
KDM4E B2RXH2 3/20 0.48
HSD17B10 Q99714 2/20 0.48
SMN1; SMN2 Q16637 2/20 0.48
APP P05067 1/20 0.48
CA12 O43570 2/20 0.42
CA2 P00918 2/20 0.42
CA9 Q16790 2/20 0.42
RAB9A P51151 2/20 0.42
KCNH2 Q12809 1/20 0.38
CYP2D6 P10635 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6535732 0.87 APP (0.43) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5184854 0.77 CYP1A2 (0.46) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2190184 0.77 APP (0.44) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL21858057 0.76 NPC1 (0.44) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL21858110 0.76 CHAT (0.45) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2114742 0.75 APP (0.75) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5871989 0.75 APP (0.75) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5403604 0.74 ALDH1A1 (0.47) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2189360 0.74 APP (0.46) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5184850 0.72 MAPT (0.44) ALDH1A1CYP1A2CYP3A4CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040247896-A1 Organic compositions HONEYWELL INTERNATIONAL INC. 2004-12-09 US claimed
EP-1461370-A1 ORGANIC COMPOSITIONS Honeywell International Inc. (US) 2004-09-29 EP claimed
WO-2003057749-A1 ORGANIC COMPOSITIONS HONEYWELL INTERNATIONAL INC. (US) 2003-07-17 WO claimed
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed
US-20070155997-A1 Organic compositions HONEYWELL INTERNATIONAL INC. 2007-07-05 US disclosed
WO-2003059984-A1 ORGANIC COMPOSITIONS HONEYWELL INTERNATIONAL INC. (US) 2003-07-24 WO disclosed
WO-2003057755-A1 ORGANIC COMPOSITION HONEYWELL INTERNATIONAL INC. (US) 2003-07-17 WO disclosed
WO-2003057749-A1 ORGANIC COMPOSITIONS HONEYWELL INTERNATIONAL INC. (US) 2003-07-17 WO disclosed
US-20030114598-A1 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards HONEYWELL INTERNATIONAL INC. 2003-06-19 US disclosed
US-6518392-B2 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-02-11 US disclosed
US-6342455-B2 SUBSTRATE WITH METALLIC STUDS AND OLIGOMER PRECURSOR INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-01-29 US disclosed
US-20010009293-A1 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds CARTER KENNETH R (US) 2001-07-26 US disclosed
US-20010009296-A1 SUBSTRATE WITH METALLIC STUDS AND OLIGOMER PRECURSOR CARTER KENNETH R (US) 2001-07-26 US disclosed
US-6265753-B1 IMIDIZING AND CURING AN OLIGOMERIC PRECURSOR COMPOUND COMPRISING A POLYBENZOXAZOLE, POLYBEZOTHIAZOLE POLYAMIC ACID ESTER END-CAPPED WITH AN ARYL-SUBSTITUTED ACETYLENE MOIETY; ENHANCED ISOTROPIC OPTICAL AND DIELECTRICAL PROPERTIES INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-07-24 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070155997-A1 Organic compositions AHR, PAH, POLL ALDH1A1 1188/4885CYP1A2 59/4885CYP3A4 138/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.