SCHEMBL21891708

SCHEMBL21891708

CC(C)(C)CN(CC(C)(C)C)C(=O)/C=C\C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ZDHHC20 Q5W0Z9 1/20 0.40
TSHR P16473 4/20 0.39
TP53 P04637 1/20 0.39
EGLN1 Q9GZT9 1/20 0.39
EGLN3 Q9H6Z9 1/20 0.39
MAPT P10636 1/20 0.35
HCAR2 Q8TDS4 5/20 0.34
ALDH1A1 P00352 3/20 0.33
SLC6A2 P23975 1/20 0.32
SLC6A4 P31645 1/20 0.32
SLC6A3 Q01959 1/20 0.32
RXRA P19793 1/20 0.32
RXRB P28702 1/20 0.32
RXRG P48443 1/20 0.32
L3MBTL1 Q9Y468 2/20 0.32
NPC1 O15118 1/20 0.32
TDP1 Q9NUW8 2/20 0.30
GAA P10253 1/20 0.30
ALOX15 P16050 1/20 0.30
RECQL P46063 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4016170 0.75 NPC1 (0.52) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL1903390 0.75 NPC1 (0.52) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL1395640 0.75 NPC1 (0.52) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL867543 0.73 ZDHHC20 (0.37) ZDHHC20TSHRALDH1A1
SCHEMBL28365617 0.72 TSHR (0.47) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL1832210 0.71 ZDHHC20 (0.53) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL1832212 0.71 ZDHHC20 (0.53) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL30764041 0.70 TSHR (0.45) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL11437778 0.70 CA12 (0.45) ZDHHC20TSHRTP53EGLN1EGLN3
SCHEMBL9171464 0.70 CA12 (0.45) ZDHHC20TSHRTP53EGLN1EGLN3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-03-19 WO disclosed