SCHEMBL2190764

SCHEMBL2190764

C#Cc1cc(C#C)cc(C23CC4CC(c5cc(C#C)cc(C#C)c5)(C2)CC(C25CC6CC(CC(C6)C2)C5)(C4)C3)c1

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
PGR P06401 1/20 0.35
ALDH1A1 P00352 1/20 0.34
LMNA P02545 1/20 0.34
MEN1 O00255 1/20 0.32
POLB P06746 1/20 0.32
GAA P10253 1/20 0.32
GFER P55789 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2187126 0.94 PGR (0.33) PGR
SCHEMBL2188002 0.93 PGR (0.40) PGRALDH1A1LMNA
SCHEMBL2191037 0.91 PGR (0.31) PGR
SCHEMBL4054713 0.89 PGR (0.39) PGRALDH1A1LMNAMEN1POLB
SCHEMBL2189703 0.86 PGR (0.41) PGRALDH1A1LMNAMEN1POLB
SCHEMBL2189735 0.85 PGR (0.41) PGRALDH1A1LMNA
SCHEMBL6392406 0.84 PGR (0.47) PGRALDH1A1LMNAMEN1POLB
SCHEMBL6698243 0.84 LMNA (0.47) PGRALDH1A1LMNAMEN1POLB
SCHEMBL2192828 0.82 PGR (0.37) PGRALDH1A1LMNAMEN1POLB
SCHEMBL2190533 0.80 GRIN2D (0.36) PGRALDH1A1LMNAMEN1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed