SCHEMBL21993318

SCHEMBL21993318

O=C(Cl)CCOc1ccc(-c2ccc(-c3ccccc3)cc2)cc1

nearest known ligand 0.66

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ MMP3 P08254 1/20 0.66
▸ HDAC1 Q13547 11/20 0.59
▸ HDAC2 Q92769 11/20 0.59
▸ HDAC3 O15379 10/20 0.59
▸ HDAC4 P56524 10/20 0.59
▸ HDAC7 Q8WUI4 10/20 0.59
▸ HDAC10 Q969S8 10/20 0.59
▸ HDAC11 Q96DB2 10/20 0.59
▸ HDAC8 Q9BY41 10/20 0.59
▸ HDAC6 Q9UBN7 10/20 0.59
▸ HDAC9 Q9UKV0 10/20 0.59
▸ HDAC5 Q9UQL6 10/20 0.59
▸ LTA4H P09960 1/20 0.54
▸ MMP2 P08253 1/20 0.53
▸ FFAR1 O14842 2/20 0.52
▸ FFAR4 Q5NUL3 1/20 0.52
▸ LSS P48449 1/20 0.49
▸ GAA P10253 1/20 0.49
▸ PKM P14618 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1308374 0.89 CYP1A2 (0.58) MMP3HDAC1HDAC2PKM
SCHEMBL7049002 0.85 MMP2 (0.70) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL14413930 0.82 MMP3 (0.66) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL2324869 0.81 MAPT (0.58) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL7049246 0.80 FFAR4 (0.75) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL351889 0.79 KCNA3 (0.58) HDAC1HDAC2PKM
SCHEMBL10609303 0.79 KMT2A (0.51) —
SCHEMBL21993319 0.79 MMP3 (0.67) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL7044763 0.79 MMP3 (1.00) MMP3HDAC1HDAC2HDAC3HDAC4
SCHEMBL20378891 0.79 MMP3 (0.62) MMP3HDAC1HDAC2HDAC3HDAC4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 — — EP disclosed
US-20200148538-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER FUJIFILM CORPORATION (JP) 2020-05-14 — — US disclosed
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