SCHEMBL22005158

SCHEMBL22005158

Cc1ccc(OCCCOc2ccc(O)cc2)cc1

nearest known ligand 0.62

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 4/20 0.62
NR5A1 Q13285 1/20 0.62
DRD2 P14416 4/20 0.57
DRD4 P21917 4/20 0.57
DRD3 P35462 4/20 0.57
ACHE P22303 1/20 0.56
L3MBTL1 Q9Y468 1/20 0.55
GPR84 Q9NQS5 1/20 0.51
MAPT P10636 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
GAA P10253 1/20 0.50
GRIN2D O15399 1/20 0.49
GRIN3B O60391 1/20 0.49
GRIN1 Q05586 1/20 0.49
GRIN2A Q12879 1/20 0.49
GRIN2B Q13224 1/20 0.49
GRIN2C Q14957 1/20 0.49
GRIN3A Q8TCU5 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10703376 0.93 ACHE (0.59) LTA4HNR5A1DRD2DRD4DRD3
SCHEMBL5929468 0.89 DRD2 (0.68) DRD2DRD4DRD3L3MBTL1MEN1
SCHEMBL2473527 0.89 LTA4H (0.68) LTA4HNR5A1DRD2DRD4DRD3
P-Cresol SCHEMBL7788914 0.88 LTA4H (0.53) LTA4HNR5A1DRD2DRD4DRD3
P-Cresol SCHEMBL11487367 0.88 LTA4H (0.75) LTA4HNR5A1DRD2DRD4DRD3
SCHEMBL28638094 0.84 KCNH2 (0.56) LTA4HNR5A1DRD2DRD4DRD3
SCHEMBL3805304 0.84 DRD2 (0.68) DRD2DRD4DRD3L3MBTL1MEN1
SCHEMBL2470706 0.84 NR5A1 (0.75) LTA4HNR5A1DRD2DRD4DRD3
SCHEMBL10704490 0.83 LTA4H (0.62) LTA4HNR5A1L3MBTL1MAPTGAA
SCHEMBL10879381 0.83 LTA4H (0.62) LTA4HNR5A1DRD2DRD4DRD3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 EP disclosed