SCHEMBL2201501

SCHEMBL2201501

CCCc1cc(C(c2ccc(O)c(CCC)c2)c2ccc(O)c(OC)c2)ccc1O

nearest known ligand 0.54

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HMGCR P04035 1/20 0.54
TSHR P16473 2/20 0.53
CYP3A4 P08684 1/20 0.53
NFKB1 P19838 1/20 0.51
BCHE P06276 2/20 0.50
TYR P14679 2/20 0.50
ACHE P22303 2/20 0.50
BLM P54132 2/20 0.50
PMP22 Q01453 1/20 0.50
NPSR1 Q6W5P4 1/20 0.48
GAA P10253 2/20 0.47
SLC22A3 O75751 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3863805 0.90 HMGCR (0.53) HMGCRTSHRCYP3A4NFKB1NPSR1
SCHEMBL2202053 0.87 ALDH1A1 (0.52) HMGCRTSHRCYP3A4BCHETYR
SCHEMBL20563424 0.83 TSHR (0.65) TSHRCYP3A4NFKB1BCHETYR
SCHEMBL2202079 0.82 ALOX5 (0.45) HMGCRTSHRCYP3A4NFKB1BLM
SCHEMBL1596291 0.82 TSHR (0.62) TSHRCYP3A4NFKB1BCHETYR
SCHEMBL2202634 0.81 BCHE (0.50) HMGCRTSHRCYP3A4NFKB1BCHE
SCHEMBL2202101 0.81 ALOX5 (0.44) HMGCRTSHRCYP3A4TYR
SCHEMBL31516847 0.79 TSHR (0.59) TSHRCYP3A4NFKB1BCHETYR
SCHEMBL29105739 0.77 BCHE (0.67) HMGCRTSHRCYP3A4NFKB1BCHE
SCHEMBL1986274 0.77 ALOX5 (0.46) HMGCRTSHRNFKB1BCHETYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
EP-1862855-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2011-10-05 EP disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
EP-1862855-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2007-12-05 EP disclosed
US-20060159839-A1 Photosensitive resin composition, electronic component using the same, and display using same TORAY INDUSTRIES, INC. (JP) 2006-07-20 US disclosed
EP-1662319-A2 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-31 EP disclosed
US-20060110680-A1 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-25 US disclosed
EP-1630605-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2006-03-01 EP disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA HMGCR 4306/4885TSHR 3566/4885CYP3A4 3788/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA HMGCR 4306/4885TSHR 3566/4885CYP3A4 3788/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.