SCHEMBL22017940

SCHEMBL22017940

Cc1cc(OC(=O)c2ccc(OCC3CO3)cc2)ccc1OC(O)c1ccc(OCC2CO2)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.38
ALDH1A1 P00352 4/20 0.38
TP53 P04637 3/20 0.38
TSHR P16473 3/20 0.38
LMNA P02545 3/20 0.38
KMT2A Q03164 3/20 0.38
HPGD P15428 2/20 0.38
PKM P14618 2/20 0.38
HIF1A Q16665 2/20 0.38
MEN1 O00255 1/20 0.38
CYP1A2 P05177 1/20 0.38
PPARG P37231 1/20 0.38
GAA P10253 1/20 0.38
RAB9A P51151 6/20 0.38
SMN1; SMN2 Q16637 5/20 0.38
NPC1 O15118 5/20 0.37
CASP3 P42574 1/20 0.37
SENP7 Q9BQF6 1/20 0.37
TDP1 Q9NUW8 2/20 0.37
VDR P11473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9923604 0.87 ALDH1A1 (0.45) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL14063055 0.84 ALDH1A1 (0.42) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL9923598 0.82 PARP15 (0.46) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL26510811 0.81 KMT2A (0.40) MAPTTP53LMNAKMT2AMEN1
SCHEMBL26247837 0.80 KMT2A (0.39) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL16172287 0.79 KMT2A (0.40) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL12566213 0.79 MAPT (0.41) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL12332456 0.78 VDR (0.45) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL14063060 0.78 KMT2A (0.39) MAPTALDH1A1TP53TSHRLMNA
SCHEMBL23386320 0.78 ALDH1A1 (0.50) MAPTALDH1A1TP53TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653660-A1 THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER, THERMALLY CONDUCTIVE MATERIAL FORMATION COMPOSITION, DISC-SHAPED LIQUID CRYSTAL COMPOUND FUJIFILM Corporation (JP) 2020-05-20 EP disclosed