SCHEMBL9923604

SCHEMBL9923604

Cc1cc(OC(=O)c2ccc(OCC3CO3)cc2)ccc1OC(=O)c1ccc(OCC2CO2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.45
MAPT P10636 3/20 0.45
TP53 P04637 3/20 0.45
TSHR P16473 3/20 0.45
LMNA P02545 3/20 0.45
KMT2A Q03164 3/20 0.45
HPGD P15428 2/20 0.45
PKM P14618 2/20 0.45
HIF1A Q16665 2/20 0.45
MEN1 O00255 2/20 0.45
CYP1A2 P05177 1/20 0.45
PPARG P37231 1/20 0.45
GAA P10253 1/20 0.45
TDP1 Q9NUW8 2/20 0.43
RAB9A P51151 5/20 0.43
SMN1; SMN2 Q16637 4/20 0.43
NPC1 O15118 4/20 0.42
CYP3A4 P08684 1/20 0.42
CASP3 P42574 1/20 0.41
SENP7 Q9BQF6 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9923598 0.94 PARP15 (0.46) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL26247837 0.92 KMT2A (0.39) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL16172287 0.92 KMT2A (0.40) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL14063055 0.92 ALDH1A1 (0.42) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL12566213 0.91 MAPT (0.41) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL22017523 0.90 RAB9A (0.43) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL13198251 0.88 KMT2A (0.41) ALDH1A1MAPTTSHRLMNAKMT2A
SCHEMBL10000343 0.88 KMT2A (0.44) ALDH1A1MAPTTP53LMNAKMT2A
SCHEMBL14363568 0.87 ALDH1A1 (0.49) ALDH1A1MAPTTP53TSHRLMNA
SCHEMBL22017940 0.87 MAPT (0.38) ALDH1A1MAPTTP53TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11795293-B2 Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device RESONAC CORPORATION (JP) 2023-10-24 US disclosed
US-11795293-B2 Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device RESONAC CORPORATION (JP) 2023-10-24 US disclosed
US-11702578-B2 Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound FUJIFILM CORPORATION (JP) 2023-07-18 US disclosed
US-11702578-B2 Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound FUJIFILM CORPORATION (JP) 2023-07-18 US disclosed
US-20210016546-A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2021-01-21 US disclosed
EP-3766911-A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE Hitachi Chemical Company, Ltd. (JP) 2021-01-20 EP disclosed
US-20200407638-A1 METHOD FOR PRODUCING CHOLESTERIC LIQUID CRYSTAL FILM FUJIFILM CORPORATION (JP) 2020-12-31 US disclosed
EP-3733730-A1 COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE HAVING THERMAL CONDUCTION LAYER, AND METHOD OF PRODUCING THERMALLY CONDUCTIVE MATERIAL Fujifilm Corporation (JP) 2020-11-04 EP disclosed
US-20200291174-A1 COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL FUJIFILE Corporation (JP) 2020-09-17 US disclosed
US-20200148931-A1 THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND DISK-LIKE LIQUID CRYSTAL COMPOUND FUJIFILM CORPORATION (JP) 2020-05-14 US disclosed
EP-2474539-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND Sumitomo Chemical Company, Limited (JP) 2012-07-11 EP disclosed
US-20120149807-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-06-14 US disclosed
US-20120149807-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-06-14 US disclosed
US-20110086185-A1 POLYMERIZABLE LIQUID CRYSTAL COMPOUND AND ITS POLYMER CHISSO CORPORATION (JP) 2011-04-14 US disclosed
US-20110009521-A1 Liquid crystalline epoxy nanicomposite material and application thereof NATIONAL TAIWAN UNIVERSITY (TW) 2011-01-13 US disclosed
US-20110009521-A1 Liquid crystalline epoxy nanicomposite material and application thereof NATIONAL TAIWAN UNIVERSITY (TW) 2011-01-13 US disclosed
US-7541071-B2 Liquid-crystalline (METH) acrylate derivatives and composition containing them CHISSO CORPORATION (JP) 2009-06-02 US disclosed
US-7541071-B2 Liquid-crystalline (METH) acrylate derivatives and composition containing them CHISSO CORPORATION (JP) 2009-06-02 US disclosed
US-7527746-B2 Liquid crystal polyfunctional acrylate derivative and polymer thereof CHISSO CORPORATION (JP) 2009-05-05 US disclosed
US-7527746-B2 Liquid crystal polyfunctional acrylate derivative and polymer thereof CHISSO CORPORATION (JP) 2009-05-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200148931-A1 THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND DISK-LIKE LIQUID CRYSTAL COMPOUND PYCARD, ASIC3, CRYAA ALDH1A1 357/4885MAPT 1176/4885TP53 3825/4885
US-11702578-B2 Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound PYCARD, ASIC3, CRYAA ALDH1A1 357/4885MAPT 1176/4885TP53 3825/4885
US-20110086185-A1 POLYMERIZABLE LIQUID CRYSTAL COMPOUND AND ITS POLYMER CCNT1, POF1B, CCND3 ALDH1A1 926/4885MAPT 2658/4885TP53 1074/4885
US-20120149807-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND DHPS, DOHH, CYP19A1 ALDH1A1 1150/4885MAPT 4091/4885TP53 1895/4885
US-20110009521-A1 Liquid crystalline epoxy nanicomposite material and application thereof NUP205, CNP, NOS2 ALDH1A1 3462/4885MAPT 984/4885TP53 3536/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.