SCHEMBL2202076

SCHEMBL2202076

CC(C)c1cc(C(c2ccc(O)c(O)c2)c2ccc(O)c(C(C)C)c2)ccc1O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 8/20 0.53
KDM4E B2RXH2 8/20 0.53
MAPT P10636 7/20 0.53
RECQL P46063 5/20 0.53
MTOR P42345 4/20 0.53
HIF1A Q16665 4/20 0.53
TSHR P16473 4/20 0.53
HSD17B10 Q99714 4/20 0.53
LMNA P02545 3/20 0.53
KMT2A Q03164 3/20 0.53
NFKB1 P19838 2/20 0.53
POLB P06746 2/20 0.53
BLM P54132 2/20 0.53
ALOX15 P16050 1/20 0.53
THPO P40225 1/20 0.53
APEX1 P27695 1/20 0.53
GABRA1 P14867 2/20 0.48
GABRB2 P47870 2/20 0.48
TRPA1 O75762 1/20 0.44
PTGS1 P23219 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1758832 0.92 GABRA1 (0.47) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL8153198 0.86 GABRA1 (0.47) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL2202094 0.86 ESR1 (0.45) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL25505374 0.86 ESR1 (0.45) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL9818054 0.85 GABRA1 (0.50) TDP1KDM4EMAPTRECQLHIF1A
SCHEMBL224395 0.83 ALOX12 (0.59) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL31655440 0.83 ALOX12 (0.59) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL3863800 0.83 MAPT (0.50) TDP1MAPTTSHRKMT2ANFKB1
SCHEMBL31516962 0.82 TDP1 (0.54) TDP1KDM4EMAPTRECQLMTOR
SCHEMBL109026 0.82 TDP1 (0.54) TDP1KDM4EMAPTRECQLMTOR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1862855-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2011-10-05 EP disclosed
US-20110210407-A1 DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-09-01 US disclosed
US-20110193244-A1 ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE MASUKO TAKASHI 2011-08-11 US disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US disclosed
US-6733880-B2 HEAT RESISTANT THERMOPLASTIC RESIN, EPOXY RESIN AND TRIPHENOL CURING AGENT; RELIABLE LOW TEMPERATURES BONDING HITACHI CHEMICAL CO., LTD. (JP) 2004-05-11 US disclosed
US-20030062630-A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same HITACHI CHEMICAL CO., LTD. (JP) 2003-04-03 US disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
EP-1146394-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION CLARIANT INTERNATIONAL LTD. (CH) 2001-10-17 EP disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA TDP1 2239/4885KDM4E 1157/4885MAPT 960/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA TDP1 2239/4885KDM4E 1157/4885MAPT 960/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.