SCHEMBL220313

SCHEMBL220313

O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[N-3].[N-3].[N-3].[N-3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2106157 0.94
SCHEMBL42699 0.94
SCHEMBL87723 0.94
SCHEMBL1370295 0.88
SCHEMBL404488 0.88
SCHEMBL5668574 0.88
SCHEMBL2003291 0.88
SCHEMBL356290 0.88
SCHEMBL16910221 0.88
SCHEMBL1369334 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 232 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118317599-A Memory unit, preparation method thereof, memory and electronic equipment 北京超弦存储器研究院 2024-07-09 CN claimed
CN-111279166-B Bandgap measurement of patterned film stacks using spectral metrology 科磊股份有限公司 2022-12-16 CN claimed
CN-111279166-A Bandgap measurement of patterned film stacks using spectral metrology 科磊股份有限公司 2020-06-12 CN claimed
US-10580684-B2 Self-aligned single diffusion break for fully depleted silicon-on-insulator and method for producing the same GLOBALFOUNDRIES INC. (KY) 2020-03-03 US claimed
US-20190318955-A1 SELF-ALIGNED SINGLE DIFFUSION BREAK FOR FULLY DEPLETED SILICON-ON-INSULATOR AND METHOD FOR PRODUCING THE SAME GLOBALFOUNDRIES U.S. INC. 2019-10-17 US claimed
US-RE46957-E1 Nonvolatile semiconductor memory device TOSHIBA MEMORY CORPORATION (JP) 2018-07-17 US claimed
CN-101944675-B The composite component of electric connector and manufacture the method for this composite component TYCO ELECTRONICS CORP. (US) 2016-01-27 CN claimed
CN-103107072-B A kind of manufacture method of multiple gate field effect transistor device SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION (CN) 2015-11-25 CN claimed
US-9196472-B2 Processing liquid for suppressing pattern collapse of fine metal structure, and method for producing fine metal structure using same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-11-24 US claimed
US-8896052-B2 Nonvolatile semiconductor memory device and method of manufacturing the same KABUSHIKI KAISHA TOSHIBA (JP) 2014-11-25 US claimed
CN-101944675-A The composite component of electric connector and make the method for this composite component TYCO ELECTRONICS CORP 2011-01-12 CN claimed
US-20100327340-A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2010-12-30 US claimed
US-7843740-B2 Method for driving a nonvolatile semiconductor memory device KABUSHIKI KAISHA TOSHIBA (JP) 2010-11-30 US claimed
US-20090244984-A1 METHOD FOR DRIVING A NONVOLATILE SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2009-10-01 US claimed
US-20090200616-A1 SEMICONDUCTOR DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2009-08-13 US claimed
CN-100503251-C Electrostatic actuator, droplet discharge head and droplet discharge apparatus SEIKO EPSON CORP (JP) 2009-06-24 CN claimed
US-20080001209-A1 Non-volatile memory device and method of manufacturing the non-volatile memory device SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-01-03 US claimed
CN-1847003-A Electrostatic actuator, liquid-jet head, liquid-jet apparatus, device including electrostatic actuator, method for manufacturing liquid-jet head SEIKO EPSON CORP (JP) 2006-10-18 CN claimed
CN-1788999-A Electrostatic actuator, droplet discharge head and method for manufacturing the droplet discharge head, droplet discharge apparatus, and device SEIKO EPSON CORP (JP) 2006-06-21 CN claimed
US-20060042544-A1 Film formation apparatus and method of using the same TOKYO ELECTRON LIMITED (JP) 2006-03-02 US claimed