SCHEMBL2106157

SCHEMBL2106157

O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[Hf+4].[N-3].[N-3].[N-3].[N-3].[O-2].[O-2].[O-2].[O-2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL404488 0.94
SCHEMBL220313 0.94
SCHEMBL407670 0.89
SCHEMBL87723 0.88
SCHEMBL42699 0.88
SCHEMBL2003291 0.82
SCHEMBL5668574 0.82
SCHEMBL4018138 0.82
SCHEMBL356290 0.82
SCHEMBL4344882 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9698241-B1 Integrated circuits with replacement metal gates and methods for fabricating the same GlobalFoundries, Inc. (KY) 2017-07-04 US disclosed
US-20160351675-A1 INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING REPLACEMENT METAL GATE ELECTRODES GLOBALFOUNDRIES U.S. INC. 2016-12-01 US disclosed
US-8236475-B2 Methods for removing a photoresist from a metal-comprising material ADVANCED MICRO DEVICES, INC. (US) 2012-08-07 US disclosed
US-8158530-B2 Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed GLOBALFOUNDRIES INC. (KY) 2012-04-17 US disclosed
US-7790624-B2 Methods for removing a metal-comprising material from a semiconductor substrate Global Foundries Inc. (KY) 2010-09-07 US disclosed
US-20100062609-A1 METHODS FOR RETAINING METAL-COMPRISING MATERIALS USING LIQUID CHEMISTRY DISPENSE SYSTEMS FROM WHICH OXYGEN HAS BEEN REMOVED ADVANCED MICRO DEVICES, INC. (US) 2010-03-11 US disclosed
US-20100015804-A1 METHODS FOR REMOVING A METAL-COMPRISING MATERIAL FROM A SEMICONDUCTOR SUBSTRATE ADVANCED MICRO DEVICES, INC. (US) 2010-01-21 US disclosed
US-20090286385-A1 METHODS FOR REMOVING A PHOTORESIST FROM A METAL-COMPRISING MATERIAL ADVANCED MICRO DEVICES, INC. (US) 2009-11-19 US disclosed